Semiconductor device

ABSTRACT

An area of a semiconductor device having a FINFET can be reduced. The drain regions of an n-channel FINFET and a p-channel FINFET are extracted by two second local interconnects from a second Y gird between a gate electrode and a dummy gate adjacent thereto, to a third Y grid adjacent to the second Y gird. These second local interconnects are connected by a first local interconnect extending in the X direction in the third Y grid. According to such a cell layout, although the number of grids is increased by one because of the arrangement of the first local interconnect, the length in the X direction can be reduced. As a result, the cell area of the unit cell can be reduced while a space between the first and second local interconnects is secured.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese PatentApplications No. 2014-166157 filed on Aug. 18, 2014, and No. 2015-067882filed on Mar. 30, 2015, the content of which is hereby incorporated byreference into this application.

TECHNICAL FIELD OF THE INVENTION

The present invention relates to a semiconductor device. Moreparticularly, the present invention relates to a technique effectivelyapplied to a semiconductor device having an FINFET.

BACKGROUND

In an LSI (Large Scale Integration) using silicon in recent years, adimension, particularly a gate length of a gate electrode of a MISFET(Metal Insulator Semiconductor Field Effect Transistor) which is acomponent of the LSI has been steadily reduced. While this reduction inthe dimension of the MISFET has been advanced along the scaling rule,various problems have appeared as a generation of a device has beenadvanced, and it is difficult to achieve both of suppression of a shortchannel effect of the MISFET and securement of a high current drivepower. Therefore, research and development of devices with a newstructure that replaces the conventional planar-type MISFET haveactively advanced.

A FINFET is one of the above-described devices with a new structure, andis a MISFET with a three-dimensional structure different from theplanar-type MISFET.

For example, U.S. Patent No. 2014/0054722 (Patent Document 1) describedbelow discloses a planar layout of a circuit element configured by usingthe FINFET.

SUMMARY

The inventors have engaged in research and development of asemiconductor device having the FINEFT, and have studied strongly on animprovement in the characteristics of the semiconductor device. Duringthe course of the studies, the inventors have found that thesemiconductor device having the FINEFT has a margin for the furtherimprovement.

The other object and novel characteristics of the present invention willbe apparent from the description of the present specification and theaccompanying drawings.

The typical ones of the inventions disclosed in the present applicationwill be briefly described as follows.

A semiconductor device according to one embodiment disclosed in thepresent application includes: a rectangular parallelepiped first finextending in a first direction; a rectangular parallelepiped second finarranged to be separated from the first fin and extending in the firstdirection; and a gate electrode arranged on the first and second finsthrough a gate insulating film and extending in a second directioncrossing the first direction. And, the semiconductor device alsoincludes a first local wiring connecting a first drain region formed inthe first fin and a second drain region formed in the second fin. Thefirst local wiring is made of a conductive film buried in an interlayerinsulating film covering the gate electrode.

According to a semiconductor device disclosed in the present applicationand described below in a typical embodiment, the characteristics of thesemiconductor device can be improved. And, an area of the semiconductordevice can be reduced.

BRIEF DESCRIPTIONS OF THE DRAWINGS

FIG. 1 is a perspective view schematically showing a configuration of asemiconductor device according to a first embodiment;

FIG. 2 is a plan view showing the configuration of the semiconductordevice according to the first embodiment;

FIG. 3 is a cross-sectional view showing the configuration of thesemiconductor device according to the first embodiment;

FIG. 4 is a circuit diagram showing the configuration of thesemiconductor device according to the first embodiment;

FIG. 5 is a plan view showing a manufacturing process for thesemiconductor device according to the first embodiment;

FIG. 6 is a cross-sectional view showing the manufacturing process forthe semiconductor device according to the first embodiment;

FIG. 7 is a plan view showing a manufacturing process for thesemiconductor device according to the first embodiment, depicting themanufacturing process to follow the manufacturing process, continuedfrom FIG. 5;

FIG. 8 is a cross-sectional view showing the manufacturing process forthe semiconductor device according to the first embodiment, continuedfrom FIG. 6;

FIG. 9 is a plan view showing the manufacturing process for thesemiconductor device according to the first embodiment, continued fromFIG. 7;

FIG. 10 is a cross-sectional view showing the manufacturing process forthe semiconductor device according to the first embodiment, continuedfrom FIG. 8;

FIG. 11 is a plan view showing the manufacturing process for thesemiconductor device according to the first embodiment, continued fromFIG. 9;

FIG. 12 is a cross-sectional view showing the manufacturing process forthe semiconductor device according to the first embodiment, continuedfrom FIG. 10;

FIG. 13 is a plan view showing the manufacturing process for thesemiconductor device according to the first embodiment, continued fromFIG. 11;

FIG. 14 is a cross-sectional view showing the manufacturing process forthe semiconductor device according to the first embodiment, continuedfrom FIG. 12;

FIG. 15 is a plan view showing the manufacturing process for thesemiconductor device according to the first embodiment, continued fromFIG. 13;

FIG. 16 is a cross-sectional view showing the manufacturing process forthe semiconductor device according to the first embodiment, continuedfrom FIG. 14;

FIG. 17 is a plan view showing the manufacturing process for thesemiconductor device according to the first embodiment, continued fromFIG. 15;

FIG. 18 is a cross-sectional view showing the manufacturing process forthe semiconductor device according to the first embodiment, continuedfrom FIG. 16;

FIG. 19 is a plan view showing the manufacturing process for thesemiconductor device according to the first embodiment, continued fromFIG. 17;

FIG. 20 is a cross-sectional view showing the manufacturing process forthe semiconductor device according to the first embodiment, continuedfrom FIG. 18;

FIG. 21 is a plan view showing a configuration of a semiconductor deviceof a first comparison example;

FIG. 22 is a plan view showing a configuration of a semiconductor deviceof a second comparison example;

FIG. 23 is a plan view showing a configuration of a semiconductor deviceof a third comparison example;

FIG. 24 is a plan view showing a configuration of a semiconductor deviceof a second embodiment;

FIG. 25 is a cross-sectional view showing a configuration of asemiconductor device of the second embodiment;

FIG. 26 is a plan view showing a positional relation among a fin, a gateelectrode, and a dummy gate according to the second embodiment;

FIG. 27 is a plan view showing a configuration of a semiconductor deviceaccording to a third embodiment;

FIG. 28 is a plan view showing a positional relation among a fin, a gateelectrode, and a dummy gate according to the third embodiment;

FIG. 29 is a cross-sectional view showing a configuration of thesemiconductor device according to the third embodiment;

FIG. 30 is a cross-sectional view showing a configuration of thesemiconductor device according to the third embodiment;

FIG. 31 is a cross-sectional view showing a configuration of thesemiconductor device according to the third embodiment;

FIG. 32 is a circuit diagram showing the configuration of thesemiconductor device according to the third embodiment;

FIG. 33 is a plan view showing a configuration of a semiconductor deviceaccording to a fourth embodiment;

FIG. 34 is a cross-sectional view showing the configuration of thesemiconductor device according to the fourth embodiment;

FIG. 35 is a plan view showing a layout of a gate electrode, a dummygate, and a fin of the semiconductor device according to the fourthembodiment;

FIG. 36 is a circuit diagram showing the configuration of thesemiconductor device according to the fourth embodiment;

FIG. 37 is a plan view showing a layout of a gate electrode, a dummygate, and a fin of a semiconductor device of a first application exampleof the fourth embodiment;

FIG. 38 is a plan view showing a layout of a gate electrode, a dummygate, and a fin of a semiconductor device of a second applicationexample of the fourth embodiment;

FIG. 39 is a plan view showing a layout of the semiconductor device asthe second application example of the fourth embodiment;

FIG. 40 is a plan view showing a configuration of a semiconductor deviceaccording to a fifth embodiment;

FIG. 41 is a cross-sectional view showing the configuration of thesemiconductor device according to the fifth embodiment;

FIG. 42 is a circuit diagram showing the configuration of thesemiconductor device according to the fifth embodiment;

FIG. 43 is a plan view showing a layout of a gate electrode, a dummygate, and a fin of a semiconductor device of a first application exampleof the fifth embodiment;

FIG. 44 is a plan view showing a layout of a gate electrode, a dummygate, and a fin of a semiconductor device of a second applicationexample of the fifth embodiment;

FIG. 45 is a plan view showing a layout of the semiconductor device ofthe second application example of the fifth embodiment;

FIG. 46 is a plan view showing a configuration of a semiconductor deviceaccording to a sixth embodiment;

FIG. 47 is a cross-sectional view showing the configuration of thesemiconductor device according to the sixth embodiment;

FIG. 48 is a circuit diagram showing the configuration of thesemiconductor device according to the sixth embodiment;

FIG. 49 is a plan view showing a layout of a semiconductor device of asecond application example of the sixth embodiment;

FIG. 50 is a plan view showing a configuration of a semiconductor deviceaccording to a seventh embodiment;

FIG. 51 is a cross-sectional view showing the configuration of thesemiconductor device according to the seventh embodiment;

FIG. 52 is a circuit diagram showing the configuration of thesemiconductor device according to the seventh embodiment;

FIG. 53 is a plan view showing a configuration of a semiconductor deviceaccording to an eighth embodiment;

FIG. 54 is a cross-sectional view showing the configuration of thesemiconductor device according to the eighth embodiment; and

FIG. 55 is a circuit diagram showing the configuration of thesemiconductor device according to the eighth embodiment.

DETAILED DESCRIPTION

In the embodiments described below, the invention will be described in aplurality of sections or embodiments when required as a matter ofconvenience. However, these sections or embodiments are not irrelevantto each other unless otherwise stated, and the one relates to the entireor a part of the other as a modification example, details, or asupplementary explanation thereof. Also, in the embodiments describedbelow, when referring to the number of elements (including number ofpieces, values, amount, range, and the like), the number of the elementsis not limited to a specific number unless otherwise stated or exceptthe case where the number is apparently limited to a specific number inprinciple. The number larger or smaller than the specified number isalso applicable.

Further, in the embodiments described below, it goes without saying thatthe components (including element steps) are not always indispensableunless otherwise stated or except the case where the components areapparently indispensable in principle.

Similarly, in the embodiments described below, when the shape of thecomponents, positional relation thereof, and the like are mentioned, thesubstantially approximate and similar shapes and the like are includedtherein unless otherwise stated or except the case where it isconceivable that they are apparently excluded in principle. The samegoes for the numerical value and others described above (includingnumber of pieces, values, amount, range, and the like).

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. Note that, in allthe drawings for describing the embodiments, members having the samefunction are denoted by the same or related reference numerals, and therepeated descriptions thereof will be omitted. When a plurality ofsimilar members (portions) are present, a symbol is added to a referencenumeral of a collective term to indicate an individual or specificportion in some cases. In the following embodiments, in principle, thesame or similar parts will not be described repeatedly particularlyunless it is required.

Also, in some drawings used in the embodiments, hatching is omitted evenin a cross-sectional view so as to make the drawings easy to see. Also,hatching is used even in a plan view so as to make the drawings easy tosee.

In cross-sectional views and plan views, a size of each portion does notcorrespond to that of an actual device, and a specific portion is shownrelatively largely so as to make the drawings easy to see in some cases.Even when a plan view corresponds to a cross-sectional view, eachportion is shown with being changed in a size.

(First Embodiment)

A semiconductor device according to the present embodiment will bedescribed in detail below with reference to drawings. The semiconductordevice according to the present embodiment includes a FINFET serving asa semiconductor element. FIG. 1 is a perspective view schematicallyshowing a configuration of the semiconductor device according to thepresent embodiment. FIG. 2 is a plan view showing the configuration ofthe semiconductor device according to the present embodiment. FIG. 3 isa cross-sectional view showing the configuration of the semiconductordevice according to the present embodiment. The cross-sectional view ofFIG. 3 corresponds to, for example, a cross-sectional part taken along aline A-A of the plan view of FIG. 2. FIG. 4 is a circuit diagram showingthe configuration of the semiconductor device according to the presentembodiment.

The characteristic configuration of the semiconductor device of thepresent embodiment will be described with reference to FIG. 1.

As shown in FIG. 1, the semiconductor device of the present embodimentincludes a FINFET formed on a main surface of a fin F formed above asemiconductor substrate (S). Here, an n-channel FINFET (NFT) and ap-channel FINFET (PFT) are formed, and these FINFETs (NFT, PFT) make upan inverter (INV1).

The n-channel FINFET (NFT) has a gate electrode Gn arranged above arectangular parallelepiped fin F through a gate insulating film (notshown in FIG. 1), and a source region (source diffusion layer) Sn and adrain region (drain diffusion layer) Dn that are formed in the fin onboth sides of the gate electrode Gn. The p-channel FINFET (PFT) has agate electrode Gp arranged above a rectangular parallelepiped fin Fthrough the gate insulating film (not shown in FIG. 1), and a sourceregion (source diffusion layer) Sp and a drain region (drain diffusionlayer) Dp that are formed in the fin on both sides of the gate electrodeGp. A gate electrode (GE) is made up by the gate electrode Gp and thegate electrode Gn. In other words, a half of the linear gate electrodeGE is the gate electrode Gp while the rest of the same is the gateelectrode Gn. The central part of this gate electrode GE, i.e., aconnection portion between the gate electrode Gp and the gate electrodeGn is connected to an input portion (IN) of an inverter INV1.

Here, in the present embodiment, the drain region Dp of the p-channelFINFET (PFT) and the drain region Dn of the n-channel FINFET (NFT) areconnected to each other by a local interconnect LIC (see FIG. 1). In thepresent specification, the local interconnect LIC (local wiring, LIC1 orLIC2) is a wiring formed in an interlayer insulating film IL1, whichwill be described later. More specifically, the local interconnect LICis a wiring made of a conductive film buried in a trench (C1 or C2) inthe interlayer insulating film IL1, which will be described later. Thisinterlayer insulating film IL1 described here is a multilayer insultingfilm covering the gate electrode GE. The local interconnect LIC (localwiring, LIC1 or LIC2) is located on a lower layer than a wiring M1 on afirst layer.

The local interconnect LIC connecting the drain region Dp and the drainregion Dn described above becomes an output portion (OUT) of theinverter (INV1), which will be described later. In other words, thelocal interconnect LIC is connected to the output portion (OUT) of theinverter (INV1), which will be described later. As described later, thelocal interconnect LIC is arranged so as to cross a P/N boundary (seeFIG. 7). Below the local interconnect LIC, a dummy gate DG is arranged.In other words, the local interconnect LIC is arranged above the dummygate DG.

The source region Sp of the p-channel FINFET (PFT) is connected to asource potential VDD through the local interconnect LIC. The sourceregion Sn of the n-channel FINFET (NFT) is connected to a groundpotential (reference potential) VSS through the local interconnect LIC.A dummy gate DG is arranged outside (left side in FIG. 1) the localinterconnect LIC connected to the source potential VDD or groundpotential VSS.

In this manner, according to the semiconductor device of the presentembodiment, the drain regions Dp and Dn are connected through the localinterconnect LIC having a substantially-formed U shape, so that theformation area (cell area) of the semiconductor device can be reduced.And, an integration degree of the semiconductor element (FINFET) can beincreased. Details will be described later.

Next, the configuration of the semiconductor device of the presentembodiment will be described in the further detail with reference toFIGS. 2 to 4.

The plan view of FIG. 2 shows FINFETs (PFT, NFT) making up an inverterINV2 in addition to the p-channel FINFET (PFT) and n-channel FINFET(NFT) making up the inverter INV1. That is, as shown in FIG. 4, theinverter INV2 is connected at a rear stage of the inverter INV1. Theinverter INV1 has the p-channel FINFET (PFT) and the n-channel FINFET(NFT) that are connected in series between the source potential VDD andthe ground potential VSS. A connection point between these FINFETsbecomes the output portion (OUT), and the gate electrodes thereof areconnected to the input portion (IN). The inverter INV2 at the rear stagehas the same configuration, and the output portion (OUT) of the inverterINV1 is connected to an input portion of the inverter INV2.

The present embodiment will be described so as to regard a region forforming the inverters INV1 and INV2 as a unit cell. While thecross-sectional view of FIG. 3 shows cross sections of the p-channelFINFET (PFT) and the n-channel FINFET (NFT) that make up the inverterINV1, the FINFETs (PFT, NFT) making up the inverter INV2 have the sameconfiguration.

First, a planar shape (shape in a plan view from above, cell layout) ofeach component of the semiconductor device of the present embodimentwill be described with reference to FIG. 2.

As shown in FIG. 2, the planar shape of each fin F is a linear shapehaving a certain width (length in the X direction) (a rectangular shapewith long sides extending in the Y direction). In FIG. 2, four fins Fformed in two rows X two columns are arranged in the X and Y directionsat a certain interval (pitch). The two left fins F in FIG. 2 are thefins F making up the inverter INV1. And, the two right fins F thereinare the fins F making up the inverter INV2 (see FIGS. 5 and 7).

As shown in FIG. 2, the planar shape of each gate electrode GE is alinear shape having a certain width (length in the Y direction) (arectangular shape with long sides extending in the X direction). Asdescribed above, the gate electrode GE extends in a direction ofcrossing the fins F. Here, in addition to the gates GE extending in thedirection of crossing the fins F, the dummy gates DG are also provided.Each dummy gate DG has the same configuration as that of the gateelectrode GE. That is, the dummy gate DG also has a linear shape havinga certain width (length in the Y direction) (a rectangular shape withlong sides extending in the X direction). In FIG. 2, seven of the gateelectrodes GE and dummy gates DG are arranged at certain intervals(intervals in the Y direction, minimum pitches in the Y direction, grid)(see FIG. 9). In this manner, a pattern regularity is ensured byarranging the dummy gate DG between the gate electrodes GE, so thatvariation in the manufacturing or others can be reduced.

Here, a region (Y grid) between the gate electrode GE and the dummy gateDG is denoted as “YG”. In FIG. 2, for example, Y girds YG1 to YG6 arearranged sequentially from left to right.

The left gate electrode GE (Gn, Gp) of the gate electrodes GE (Gn, Gp)extending in the direction of crossing the fins F makes up the inverterINV1, while the right gate electrode GE (Gn, Gp) thereof makes up theinverter INV2. As described later, note that the gate electrode GE ismade of a conductive film extending integrally in the X direction and isshown as the gate electrode Gp in a region for forming the p-channelFINFET (PFT) because a p-type impurity is introduced in this region.Also, this is denoted as the gate electrode Gn in a region for formingthe n-channel FINFET (NFT) because an n-type impurity is introduced inthis region. By these gate electrodes Gp and Gn, the gate electrode GEis made up.

Here, the above-described interval in the Y direction (width in the Ydirection of the Y grid) is a reference for determining the length ofthe unit cell in the Y direction. For example, when the interval in theY direction is 0.09 μm, the length of the unit cell in the Y directionis determined to be 0.09×6=0.54 μm. Here, when the length thereof in theX direction is 0.77 μm, the cell area of the unit cell of FIG. 2 is0.4158 μm².

The source region Sp and the drain region Dp are arranged in the fins Fon both sides of the gate electrode GE (Gp). Also, the source region Snand the drain region Dn are arranged in the fin F on both sides of thegate electrode GE (Gn). Note that the fin F and the gate electrode GEoverlap with each other through a gate insulating film (GI) (see FIG.3). More specifically, the gate insulating film (GI) is arranged on aside surface and a front surface of the fin F in a region where the finF and the gate electrode GE overlap with each other.

As shown in FIG. 2, the planar shape of each local interconnect (LIC1,LIC2) is a rectangular parallelepiped shape with long sides extending inthe X direction or a rectangular parallelepiped shape with long sidesextending in the Y direction. Here, the rectangular one (part, portion)with long sides extending in the X direction is denoted as “LIC1”, whilethe rectangular one (part, portion) with long sides extending in the Ydirection is denoted as “LIC2”. As described later, the localinterconnect (LIC1, LIC2) is formed by burying a conductive film in thetrench (C1, C2) formed in the interlayer insulating film (IL1). When thetrench is formed, a processed photoresist film is used as a mask. Whenthe photoresist film is processed (exposed to light), a rectangularpattern with long sides extending in the X direction and a rectangularpattern with long sides extending in the Y direction are transferredseparately from each other. By such processing, even a fine pattern canbe formed with high accuracy.

The drain regions (Dp and Dn) of the p-channel FINFET (PFT) andn-channel FINFET (NFT) making up the inverter INV1 are connected to eachother through the local interconnects (LIC1, LIC2).

The drain region (Dp) of the p-channel FINFET (PFT) is extracted by thelocal interconnect LIC1. This local interconnect LIC1 is connected to alocal interconnect LIC1 connected to the output portion (OUT) throughthe local interconnect LIC2 crossing the dummy gate DG. The drain region(Dn) of the n-channel FINFET (NFT) is extracted by the localinterconnect LIC1. This local interconnect LIC1 is connected to a localinterconnect LIC1 connected to the output portion (OUT) through thelocal interconnect LIC2 crossing the dummy gate DG. Hence, in FIG. 2,the drain regions (Dp, Dn) are connected through five localinterconnects (LIC1, LIC2). These five local interconnects (LIC1, LIC2)form a substantially-formed U shape.

Note that the drain regions (Dp, Dn) may be connected through threelocal interconnects (LIC1, LIC2). That is, the drain regions (Dp, Dn)may be connected directly by the local interconnects LIC2 extending inthe Y direction, and be connected to the local interconnect LIC1connected to the output portion (OUT) therebetween.

As shown in FIG. 2, the source region Sp of the p-channel FINFET (PFT)making up the inverter INV1 is connected to the local interconnect LIC1.This local interconnect LIC1 is connected to a wiring M1 (VDD) on whicha source potential (VDD) is applied through a via V0 described later.Also, the source region Sn of the n-channel FINFET (NFT) is connected tothe local interconnect LIC1. This local interconnect LIC1 is connectedto a wiring M1 (VSS) connected to the ground potential (VSS) through avia V0 described later (also see FIG. 3).

As shown in FIG. 2, the local interconnect LIC2 is arranged on theboundary between the gate electrode Gp and the gate electrode Gn. Thislocal interconnect LIC2 is connected to a wiring M1 (IN) serving as aninput portion (IN) through a via V0 described later (see FIG. 3).

Note that the FINFETs (PFT, NFT) making up the inverter INV2 arearranged in the right region of the unit cell shown in FIG. 2. Theinverter INV2 has the same configuration as that of the inverter INV1,and therefore, the local interconnects (LIC1, LIC2) having the sameshape as those of the local interconnects (LIC1, LIC2) connected to theinverter INV1. As described above, the output portion of the inverterINV1 is connected to the input portion of the inverter INV2, and theoutput portion and the input portion are connected to each other by thewiring M1 through via V0.

The above-described wiring M1 (VDD) of the wirings M1 extends in the Ydirection at an end of the region for forming the p-channel FINFET (PFT)(upper side in FIG. 2), while the wiring M1 (VSS) extends in the Ydirection at an end of the region for forming the n-channel FINFET (NFT)(lower side in FIG. 2). Note that the present embodiment has beendescribed while exemplifying the inverter INV2 as a circuit connected atthe rear stage. However, another logical circuit may be connected.

[Description of Manufacturing Method]

Next, a method of manufacturing the semiconductor device of the presentembodiment will then be described with reference to FIGS. 5 to 20, andthe configuration of the semiconductor device will be descried moreclearly. FIGS. 5 to 20 are a cross-sectional view or a plan view showingmanufacturing processes for the semiconductor device of the presentembodiment. Note that a rectangular region encircled with a broken linein a plan view represents a region for forming the unit cell. Thefollowing processes are one example of the manufacturing processes forthe semiconductor device of the present embodiment, and thesemiconductor device of the present embodiment may be manufactured bydifferent manufacturing processes.

As shown in FIGS. 5 and 6, the semiconductor substrate S is prepared,and the fin (protrusion) F is formed thereon. The semiconductorsubstrate S is, for example, a silicon substrate. For example, aphotoresist film (not shown) is formed on the semiconductor substrate S,and is exposed to light, so that a plurality of linear patterns formedof the photoresist film a linear shape (each pattern having arectangular shape with long sides in the Y direction) are formed.Subsequently, the semiconductor substrate S is etched while using thephotoresist film patterns as a mask, so that a plurality of fins (convexportions) are formed. The plurality of fins F are each formed into alinear shape having a certain width, and are arranged into a tworows×two columns with certain intervals (pitches). A portion betweenthese fins F becomes a trench (concave portion). In this manner, aprocessing for forming a lower layer material into a desired shape byperforming the etching while using a photoresist film processed into adesired shape by the exposure and the development or a hard-mask film asa mask is called patterning.

Subsequently, as shown in FIGS. 7 and 8, a lower part of each trench(concave portion) formed between these fins F is filled with aninsulating film to form an element isolation film ISO. For example, asilicon oxide film is deposited on the semiconductor substrate S as aninsulating film by a CVD (Chemical Vapor Deposition) method etc., and isetched back to form the element isolation film ISO.

Subsequently, an n-type well NW is formed in the region for forming thep-channel FINFET (PFT) of the semiconductor substrate S, and a p-typewell PW is formed in the region for forming the n-channel FINFET (NFT)of the semiconductor substrate S.

The region for forming the n-channel FINFET (PFT) of the semiconductorsubstrate S is covered with a photoresist film, and n-type impurity ionsare implanted into the region for forming the p-channel FINFET (PFT)(e.g., the upper half region in FIG. 7) to form the n-type well NW.Then, the above-described photoresist film is removed, the region forforming the p-channel FINFET (PFT) of the semiconductor substrate S iscovered with a photoresist film, and p-type impurity ions are implantedinto the region for forming the n-channel FINFET (NFT) (e.g., the lowerhalf region in FIG. 7) to form the p-type well PW.

Subsequently, as shown in FIGS. 9 and 10, the gate electrodes GE and thedummy gates DG are formed. The gate insulating film GI is formed firston the surfaces of the fins F. For example, a silicon oxide film isformed on the surfaces of the fins F by an oxidation method. Further, ahigh dielectric constant film is deposited on this silicon oxide film byCVD. In this manner, the gate insulating film GI made of a laminationfilm of the silicon oxide film and the high dielectric constant film canbe formed. Subsequently, the gate electrode GE is formed above the finsF through the gate insulating film GI. In other words, the gateelectrode GE is formed so as to be across a plurality of the fins F. Thedummy gate DG is formed on the element isolation film ISO.

For example, on the gate insulating film GI and element isolation filmISO, a polysilicon film is formed as a gate electrode material by theCVD method etc. Subsequently, the surface of the polysilicon film isflattened by a CMP (Chemical Mechanical Polishing) method etc.Subsequently, the polysilicon film is patterned to form the gateelectrodes GE and dummy gates DG. Here, in the unit cell forming region,seven of the gate electrodes GE and dummy gates DG are arranged atcertain intervals (intervals in the Y direction, a grid). In thispatterning process, the gate insulating film GI exposed from both sidesof the gate electrode GE may be removed.

Subsequently, p-type impurity ions are implanted into the gateelectrodes GE and dummy gates DG located in the region for forming thep-channel FINFET (PFT) (e.g., the upper half region in FIG. 2). As aresult, the p-type gate electrodes Gp are formed. Subsequently, N-typeimpurity ions are then implanted into the gate electrodes GE and dummygates DG located in the region for forming the n-channel FINFET (NFT)(e.g., the lower half region in FIG. 2). As a result, the n-type gateelectrodes Gn are formed. Note that the impurity ions are implanted alsointo the dummy gates DG, and therefore, p-type dummy gates DGp andn-type dummy gates DGn are formed. So-called “polymetal structure” maybe adopted as the structure of the gate electrode. At this time,different metal materials may be used in the region for forming thep-channel FINFET (PFT) and the region for forming the n-channel FINFET(NFT), respectively.

Subsequently, as shown in FIGS. 11 and 12, the interlayer insulatingfilm IL1 is formed so as to form trenches C1. For example, a siliconoxide film is deposited on the semiconductor substrate S by the CVDmethod, etc., and a surface thereof is flattened by the CMP method,etc., to form the interlayer insulating film IL1 covering the gateelectrodes GE and the dummy gates DG. Subsequently, a photoresist filmhaving openings in a region for forming the local interconnects LIC1 isformed on the interlayer insulating film IL1, and the interlayerinsulating film IL1 is etched while using this photoresist film as amask, to form the trenches (local interconnect trenches) C1.

Subsequently, as shown in FIGS. 13 and 14, trenches C2 are formed in theinterlayer insulating film IL1. For example, a photoresist film havingopenings in a region for forming the local interconnects LIC2 is formedon the interlayer insulating film IL1, and the interlayer insulatingfilm IL1 is etched while using this photoresist film as a mask, to formthe trenches (local interconnect trenches) C2.

In the photoresist film, note that the region for forming the localinterconnects LIC1 is exposed to light and the region for forming thelocal interconnects LIC2 is exposed to light, and then, they aredeveloped, to form a photoresist film having openings in the region forforming the local interconnects LIC1 and the region for forming localinterconnects LIC2. In this case, the trenches C1 and C2 can be formedby the etching process once while using such a photoresist film as amask.

In this manner, when the photoresist film is processed (exposed tolight), a rectangular pattern with long sides in the X direction thatcorrespond to the trench C1 and a rectangular pattern with long sides inthe Y direction that correspond to the trench C2 are separately exposedto light (transferred), so that even fine patterns can be exposed tolight with high accuracy.

Subsequently, as shown in FIGS. 15 and 16, the trenches C1 and C2 formedin the interlayer insulating film IL1 are filled with a conductive filmto form the local interconnects LIC1 and LIC2. For example, theconductive film is deposited on the interlayer insulating film IL1including the trenches C1 and C2 by a sputtering method. Subsequently,the conductive film portion outside the trenches C1 and C2 is removed byan etching back method, the CMP method, etc.

By these local interconnects LIC1 and LIC2, the drain regions (Dp, Dn)are electrically connected. The local interconnects LIC1 and LIC2connecting the drain regions (Dp, Dn) are made of an integrally formedconductive film. The local interconnects LIC1 and LIC2 connecting thedrain regions (Dp, Dn) are formed on the dummy gate DG. In other words,each of two local interconnects LIC2 among the local interconnects LIC1and LIC2 connecting the drain regions (Dp, Dn) crosses the dummy gateDG, and is connected to a local interconnect LIC1 (see FIGS. 15 and 16).This local interconnect LIC1 is arranged so as to extend in the Xdirection and across above the boundary between the p-type well PW andthe n-type well NW (see FIG. 7).

In this manner, the drain regions (Dp, Dn) are extracted by two localinterconnects LIC2, respectively, from the Y grid YG2 between the gateelectrode GE and the adjacent dummy gate DG to the adjacent Y grid YG3,and these local interconnects LIC2 are connected by the localinterconnect LIC1 extending in the X direction in the Y grid YG3. Inthis manner, the drain regions (Dp, Dn) are connected by the localinterconnects, and are extracted to the Y grid YG3 adjacent to the Ygrid YG2 between the gate electrode GE and the dummy gate adjacentthereto, so that the unit cell area can be reduced.

In FIG. 15, the drain regions (Dp, Dn) are connected respectively bylocal interconnects LIC1 extending in the X direction. However, theselocal interconnects LIC1 may be omitted so that the drain regions (Dp,Dn) are connected directly by the local interconnects LIC2 extending inthe Y direction, respectively.

The local interconnect LIC1 is formed also on the source region Sp andon the source region Sn, and the local interconnect LIC2 is formed alsoon the gate electrode GE (i.e., on the boundary between the gateelectrodes Gp and Gn).

Subsequently, as shown in FIGS. 17 and 18, an interlayer insulating filmIL2 is formed, and a via (connecting portion) V0 is formed in theinterlayer insulting film IL2. For example, a silicon oxide film isdeposited on the semiconductor substrate S by the CVD method, etc., anda surface thereof is flattened by the CMP method, etc., to form theinterlayer insulating film IL2 on the local interconnects LIC1 and LIC2.Subsequently, the interlayer insulating film IL2 on the localinterconnects LIC1 and LIC2 is etched to form a via hole. Subsequently,the via V0 is formed by filling the via hole formed in the interlayerinsulating film IL2 with a conductive film. For example, the conductivefilm is deposited on the interlayer insulating film IL2 including thevia hole by a sputtering method, etc. Subsequently, a conductive filmoutside the via hole is removed by an etching back method, a CMP method,etc.

Subsequently, as shown in FIGS. 19 and 20, the wiring M1 is formed onthe interlayer insulating film IL2. For example, a conductive film isdeposited on the interlayer insulating film IL2 by a sputtering method,etc., and is patterned to form the wiring M1. After this, a multilayerwiring may be formed by repeating processes of forming an interlayerinsulating film, a connecting portion (plug), and a wiring. The wiringmay be formed by patterning a conductive film or by using the so-calleddamascene method. In the damascene method, a wiring trench is formed inan insulating film, and a conductive film is buried in the wiringtrench, to form the wiring.

By the above-described processes, the semiconductor device of thepresent embodiment can be manufactured.

According to a cell layout of the semiconductor device of the presentembodiment, a forming area (cell area) can be reduced. Particularly, alayout restriction of design rules for a semiconductor device having anFINFET is strict, and therefore, such devised layout topology asdescribed in the present embodiment is essential in order to achieve astandard cell with a small area. The effectiveness of the cell layout ofthe semiconductor device of the present embodiment will be describedbelow with reference to first to third comparison examples. FIGS. 21 to23 are plan views showing configurations of semiconductor devices offirst to third comparison examples, respectively. In FIGS. 21 to 23, thecomponents corresponding to those in FIG. 2, etc., are denoted by thesame reference symbols, and are omitted in detailed description.

In a cell layout of the first comparison example shown in FIG. 21, thedrain regions (Dp, Dn) are connected through a wiring M1. A wiring M1 isformed also on the source region Sp and on the source region Sn, and awiring M1 (IN) is formed also on the gate electrode GE. The outputportion of the inverter at the front stage (the left inverter in FIG.21) and the input portion of the inverter at the rear stage (the rightinverter in FIG. 21) are connected through a via V1 and a wiring M2(OUT). In such a layout, the interval in the Y direction is determinedto be 0.064 based on the minimum wiring pitch. The length of the unitcell in the Y direction is determined to be 0.064×10=0.64 μm, the lengththereof in the X direction determined to be 1 μm, and the cell area ofthe unit cell of FIG. 21 is 0.64 μm².

Accordingly, as described in the second comparison example shown in FIG.22, such a layout that the length in the Y direction is shortened byproviding the local interconnects LIC1 and LIC2 to the Y grids YG1, YG2,YG4, and YG5 is considered. In such a layout, the interval in the Ydirection is determined to be 0.09, the length of the unit cell in the Ydirection is determined to be 0.09×5=0.45 μm, and the length thereof inthe X direction is determined to be 1 μm, so that the area of the unitcell of FIG. 22 is 0.45 μm².

And, when such a layout that the length thereof in the X direction isshortened to be 0.77 μm as described in the third comparison exampleshown in FIG. 23 is considered, the area of the unit cell can bereduced, however, the distance between the local interconnect LIC1 andthe local interconnect LIC2 is also reduced or they are adverselyconnected to each other (see an arrow part in FIG. 23).

On the other hand, as described above with reference to FIG. 2 in thepresent embodiment, the drain regions (Dp, Dn) are extracted from the Ygrid YG2 between the gate electrode GE and the dummy gate DG adjacentthereto, to the Y grid YG3 adjacent to the Y grid G2, by two localinterconnects LIC2, respectively. And, these local interconnects LIC2are connected by the local interconnect LIC1 extending in the Xdirection in the Y grid YG3. Therefore, although the number of grids isincreased by one, the length thereof in the X direction is reduced tobe, for example, 0.77 μm.

As a result, the area of the unit cell can be reduced while a spacebetween the local interconnects LIC1 and LIC2 are secured. Specifically,the cell area can be reduced (to be 0.4158 μm²) smaller than the cellarea (0.64 μm²) of the first comparison example and the cell area (0.45μm²) of the second comparison example. In other words, the cell area canbe reduced to be about 35% of the first comparison example (0.64 μm²)and about 7.5% of the cell area of the second comparison example (0.45μm²).

In this manner, according to the cell layout of the semiconductor deviceof the present embodiment, the forming area (cell area) of thesemiconductor device can be reduced. And, high integration of thesemiconductor element can be achieved.

(Second Embodiment)

According to the first embodiment, the fin F is arranged so as to crossthe gate electrode GE only. However, the fin F may be extended to aportion below each of the dummy gates DG located on both sides of thegate electrode GE.

FIG. 24 is a plan view of a configuration showing a configuration of asemiconductor device according to the present embodiment. FIG. 25 is across-sectional view showing the configuration of the semiconductordevice according to the present embodiment. The cross-sectional view ofFIG. 25 corresponds to, for example, a cross section taken along a lineA-A of the plan view of FIG. 24. Note that a circuit diagram showing theconfiguration of the semiconductor device according to the presentembodiment is the same as the circuit diagram of the first embodiment(FIG. 4).

The semiconductor device of the present embodiment has the sameconfiguration as the semiconductor device of the first embodiment exceptfor the configuration of the fin F, and therefore, detailed descriptionof the semiconductor device will be omitted except for the configurationof the fin F. FIG. 26 is a plan view showing the positional relationbetween the fin F, the gate electrode GE, and the dummy gate DG.

The semiconductor device of the present embodiment includes the FINFETsformed on the main surfaces of the fins F as similar to thesemiconductor device of the first embodiment. Here, the n-channel FINFET(NFT) and the p-channel FINFET (PFT) are formed, and these FINFETs (NFT,PFT) make up the inverter INV1 (see FIGS. 24 and 4).

As shown in FIGS. 24 and 26, the planar shape of each fin F is a linearshape having a certain width (length in the X direction) (a rectangularshape with long sides extending in the Y direction). In FIGS. 24 and 26,two by two, i.e., four fins F arranged in two rows x two columns arearranged at a certain interval (pitch). Two left fins F shown in FIG. 2are the fins F making up the inverter INV1. And, two right fins F arethe fins F making up the inverter INV2. In the present embodiment, thefins F extend to places below the dummy gates DG. Note that the dummygates DG are arranged on the fins F through the gate insulating film GI.However, no fin F is formed on one side of the dummy gate DG (right sidein FIG. 26), and therefore, an ON state is not generated, and there isno problem on circuit operations.

As shown in FIGS. 24 and 26, the planar shape of each gate electrode GEis a linear shape having a certain width (length in the Y direction) (arectangular shape with long sides extending in the X direction). In thismanner, the gate electrode GE extends in a direction of crossing thefins F. Here, in addition to the gate electrode GE extending in thedirection of crossing the fin F, the dummy gate DG is also provided.Each dummy gate DG has the same configuration with the gate electrodeGE. That is, the dummy gate DG also has a linear shape having a certainwidth (length in the Y direction) (a rectangular shape with long sidesextending in the X direction). In FIGS. 24 and 26, seven of the gateelectrodes GE and dummy gates DG are arranged at a certain interval(interval in the Y direction). The left gate electrode GE of the gateelectrodes GE extending in the direction of crossing the fins F makes upthe inverter INV1, while the right gate electrode GE thereof makes upthe inverter INV2. Note that the gate electrode GE is made of aconductive film extending integrally in the X direction as similar tothe first embodiment. However, in the region for forming the p-channelFINFET (PET), the gate electrode GE is shown as the gate electrode Gpbecause a p-type impurity is introduced into this region. Also, in theregion for forming the n-channel FINFET (NET), the gate electrode GE isshown as the gate electrode Gn because an n-type impurity is injectedinto this region. The gate electrode GE is made up by these gateelectrodes Gp and Gn.

Here, the above-described interval in the Y direction is the referencefor determining the length of the unit cell in the Y direction. Forexample, when the above-described interval in the Y direction is 0.09μm, the length of the unit cell in the Y direction is determined to be0.09×6=0.54 μm. Here, when the length thereof in the X direction is 0.77μm, the cell area of the unit cell of FIG. 24 is calculated at 0.4158μm² as similar to the cell area of the first embodiment.

And, as similar to the first embodiment, the source region Sp and thedrain region Dp are arranged in the fin F on both sides of the gateelectrode GE (Gp), and the local interconnect (LIC1, LIC2) is arrangedon the gate electrode GE (Gp), source region Sp, and drain region Dp.The shape (layout)) of the local interconnect (LIC1, LIC2) is the sameas the shape (layout)) of the case of the first embodiment (FIG. 2).

In this manner, also in the present embodiment, as similar to the caseof the first embodiment (FIG. 2), the drain regions (Dp, Dn) areextracted from the Y grid YG2 between the gate electrode GE and thedummy gate DG adjacent thereto, to the Y grid YG3 adjacent to the Y gridG2, by two local interconnects LIC2, respectively. And, these localinterconnects LIC2 are connected by the local interconnect LIC1extending in the X direction in the Y grid YG3 (see FIGS. 24 and 25). Inthis manner, according to the cell layout of the present embodiment,although the number of grids is increased by one to be larger than thatof the second comparison example (FIG. 22), the length in the Xdirection can be shortened to be, for example, 0.77 μm. As a result, thecell area of the unit cell can be reduced while a space between thelocal interconnects LIC1 and LIC2 is secured.

In this manner, according to the cell layout of the semiconductor deviceof the present embodiment, the forming area (cell area) of thesemiconductor device can be reduced. And, high integration of thesemiconductor element can be achieved.

By the long extension of the fins F in the Y direction, the mobility ofcarriers is improved because of the strain effect. An ON current can beincreased. In this manner, by the long extension of the fins F in the Ydirection, the characteristics of the FINFET can be improved. In orderto obtain such a strain effect, a layer (e.g., SiGe layer) having adifferent lattice constant from that of Si or others may be formed onthe source region and the drain region. Also in such a case, by the longextension of the fins F in the Y direction, the mobility of carriers canbe improved without moderating the strain effect.

Note that the semiconductor device of the present embodiment can beformed by the same processes as those of the first embodiment.

(Third Embodiment)

In the first embodiment, the fins F are arranged so as to cross the gateelectrode GE only. However, in the unit cell forming region, the fins Fmay be arranged so as to continuously extend in the Y direction withoutbeing cut (see FIG. 28). In this case, the fin F passes through aportion below the dummy gate DG located on both sides of the gateelectrode GE, and extends to the Y grid adjacent to the dummy gate DG.

FIG. 27 is a plan view showing a configuration of a semiconductor deviceaccording to the present embodiment. FIG. 28 is a plan view showing thepositional relation between the fin F, gate electrode GE, and dummy gateDG. FIGS. 29 to 31 are cross-sectional views showing the configurationof the semiconductor device according to the present embodiment. Thecross-sectional view of FIG. 29 corresponds to, for example, acrosssection taken along a line A-A of the plan view of FIG. 27. Thecross-sectional view of FIG. 30 corresponds to, for example, acrosssection taken along a line A-B of the plan view of FIG. 27, and thecross-sectional view of FIG. 31 corresponds to, for example, acrosssection taken along a line A-C of the plan view of FIG. 27. FIG. 32 is acircuit diagram showing the configuration of the semiconductor deviceaccording to the present embodiment. Note that the semiconductor deviceof the present embodiment has the same configuration with thesemiconductor device of the first embodiment except for theconfiguration of the fin F, and therefore, detailed description of thesemiconductor device of the present embodiment will be omitted exceptfor the configuration of the fin F.

The semiconductor device of the present embodiment includes the FINFETformed on the main surface of the fin F as similar to the semiconductordevice of the first embodiment. Here, the n-channel FINFET (NFT) and thep-channel FINFET (PFT) are formed in the left-half region of the regionfor forming the unit cell, and these FINFETs (NFT, PFT) make up theinverter INV1 (see FIGS. 27 and 32). The FINFETs (NFT, PFT) in theright-half region of the region for forming the unit cell make up theinverter INV2.

As shown in FIGS. 27 and 28, the planar shape of each fin F is a linearshape having a certain width (length in the X direction) (a rectangularshape with long sides extending in the Y direction). In FIGS. 27 and 28,two fins F are arranged in parallel with each other across a certaininterval (pitch). The fin F located in the left-half region among twofins F shown in FIG. 27 make up the inverter INV1. And, the fin Flocated in the right-half region among the two fins F shown in FIG. 27make up the inverter INV2. In the present embodiment, the fins F extendin the Y direction, from one end to the other end of the unit cellforming region (see FIG. 28). In other words, the fins F are formed soas to pass through portions below seven of the gate electrodes GE anddummy gates DG formed in the unit cell forming region.

As shown in FIGS. 27 and 28, the planar shape of each gate electrode GEis a linear shape having a certain width (length in the Y direction) (arectangular shape with long sides extending in the X direction). Asdescribed above, the gate electrode GE extends in a direction ofcrossing the fins F. The dummy gates DG are arranged on both sides ofthe gate electrode GE. However, in FIG. 27, the dummy gate DG is dividedat a boundary between the region for forming the p-channel FINFET (PFT)and the region for forming the n-channel FINFET (NFT). In other words,the dummy gate DG is formed individually in the upper-half region andlower-half region of the unit cell of FIG. 27. Note that the dummy gatesDG on the same line may be connected together.

In FIGS. 27 and 28, seven of the gate electrodes GE and dummy gates DGare arranged at a certain interval (interval in the Y direction) (seeFIG. 28). The left gate electrode GE of the gate electrodes GE extendingin the direction of crossing the fins F is the gate electrode GE makingup the inverter INV1, while the right gate electrode GE thereof is thegate electrode GE making up the inverter INV2.

Note that the gate electrode GE is made of a conductive film extendingintegrally in the X direction as similar to the gate electrode GE of thefirst embodiment. However, in the region for forming the p-channelFINFET (PET), the gate electrode GE is shown as the gate electrode Gp inthis region because a p-type impurity is introduced thereto. Also, inthe region for forming the n-channel FINFET (NET), the gate electrode GEis shown as the gate electrode Gn in this region because an n-typeimpurity is introduced thereto. The gate electrode GE is made up bythese gate electrodes Gp and Gn.

Here, the above-described interval in the Y direction is the referencefor determining the length of the unit cell in the Y direction. Forexample, when the interval in the Y direction is 0.09 μm, the length ofthe unit cell in the Y direction is determined to be 0.09×6=0.54 μm.Here, when the length thereof in the X direction is 0.77 μm, the cellarea of the unit cell of FIG. 24 is calculated at 0.4158 μm² as similarto the cell area of the first embodiment.

And, as similar to the first embodiment, the source region Sp and thedrain region Dp are formed in the fin F on both sides of the gateelectrode GE (Gp), and the local interconnects (LIC1, LIC2) are arrangedon the gate electrode GE (Gp), source region Sp, and drain region Dp.The shape (layout) of the local interconnect (LIC1, LIC2) is the same asthat of the case of the first embodiment (FIG. 2).

Here, two dummy gates DG are arranged between the gate electrode GEmaking up the inverter INV1 and the gate electrode GE making up theinverter INV2. The dummy gate DG on the inverter INV1 side among thesedummy gates is not turned to be ON because no potential difference(between the source and the drain) is generated in the impurity regionin the fin F on both sides of the dummy gate DG, and therefore, there isno problem for circuit operations.

Also, a potential of the dummy gate DG on the inverter INV2 side amongthe two dummy gates is fixed by a local interconnect LIC22, andtherefore, is not turned to be ON (also see FIG. 32).

That is, a dummy transistor is made up by the dummy gate DG on theinverter INV2 side and the impurity region in the fin on both sides ofthe dummy gate. The dummy transistor formed in the upper-half region ofthe unit cell of FIG. 27 among such dummy transistors is a p-channeldummy transistor (DPT). Therefore, the local interconnect LIC1 connectedto the source potential (VDD) and the dummy gate DG are connected by thelocal interconnect LIC22, so that the potential of the dummy gate DG isfixed to the source potential (VDD) (also see FIG. 30). The dummytransistor formed in the lower-half region of the unit cell of FIG. 27is an n-channel dummy transistor (DNT). Therefore, the localinterconnect LIC1 connected to the ground potential (VSS) and the dummygate DG are connected by a local interconnect LIC22, so that thepotential of the dummy gate DG is fixed to the ground potential (VSS)(also see FIG. 31). In this manner, these dummy transistors are notturned to be ON, so that the influence on circuit operations can beavoided.

In other words, the source region (Sp) of the p-channel FINFET (PFT)making up the inverter INV2 and the dummy gate DG in contact with thesource region (Sp) are connected by the local interconnect LIC22. Also,the source region (Sp) of the n-channel FINFET (NFT) making up theinverter INV2 and the dummy gate DG in contact with the source region(Sp) are connected by the local interconnect LIC22. In this manner, nochannel is formed below the dummy gate DG, so that the influence oncircuit operations can be avoided.

As shown in FIG. 32, also in the semiconductor device of the presentembodiment, the inverter INV2 is connected at the rear stage of theinverter INV1. The inverter INV1 has the p-channel FINFET (PFT) and then-channel FINFET (NFT) that are connected in series between the sourcepotential VDD and the ground potential VSS, a connection point betweenthese FINFETs becomes the output portion (OUT), and the gate electrodesof these FINFETs are connected to the input portion (IN). The inverterINV2 at the rear stage has the same configuration in which the outputportion (OUT) of the inverter INV1 is connected to the input portion ofthe inverter INV2. In the present embodiment, the above-describedp-channel dummy transistor DPT and n-channel dummy transistor DNT areconnected in series between the source potential VDD and the groundpotential VSS, and a connection point between these dummy transistors isconnected to the output portion (OUT) of the inverter INV1 and to theinput portion of the inverter INV2. However, as described above, thegate electrode of the p-channel dummy transistor DPT is connected to thesource potential VDD, while the gate electrode of the n-channel dummytransistor DNT is connected to the ground potential VSS. Therefore,these dummy transistors are not turned to be ON. Therefore, these dummytransistors do not adversely affect the circuit operations.

In this manner, according to the present embodiment, as similar to thefirst embodiment (FIG. 2), the drain regions (Dp, Dn) are extracted bythe two respective local interconnects LIC2 from the Y grid YG2 betweenthe gate electrode GE and the dummy gate DG adjacent thereto, to the Ygrid YG3 adjacent to the Y grid G2. And, these two local interconnectsLIC2 are connected in the Y grid YG3 by the local interconnect LIC1extending in the X direction (see FIGS. 27 and 29). In this manner,according to the cell layout of the present embodiment, the number ofgrids is increased by one so as to be larger than that of the secondcomparison example (FIG. 22), however, the length in the X direction isshortened to be, for example, 0.77 μm. As a result, the cell area of theunit cell can be reduced while a space between the local interconnectsLIC1 and LIC2 is secured.

In this manner, according to the cell layout of the semiconductor deviceof the present embodiment, the forming area (cell area) of thesemiconductor device can be reduced. And, the integration degree of thesemiconductor element can be increased.

By largely extending the fins F in the Y direction, the mobility ofcarriers is improved because of a strain effect. In this manner, the ONcurrent can be increased. As described above, by largely extending thefins F in the Y direction, the characteristics of the FINFET can beimproved. In order to obtain such a strain effect, a layer (e.g., SiGelayer) having a different lattice constant from that of Si may be formedon the source region and the drain region. Also in such a case, bylargely extending the fins F in the Y direction, the mobility ofcarriers can be improved without moderating the strain.

Note that the semiconductor device of the present embodiment can beformed by the same processes as those in the first embodiment.

(Fourth Embodiment)

Hereinafter, a semiconductor device according to a present embodimentwill be described in detail with reference to drawings. Thesemiconductor device according to the present embodiment includes theFINFETs serving as semiconductor elements. FIG. 33 is a plan viewshowing a configuration of the semiconductor device according to thepresent embodiment. FIG. 34 is a cross-sectional view showing theconfiguration of the semiconductor device according to the presentembodiment. The cross-sectional view of FIG. 34 corresponds to, forexample, a cross section taken along a line A-A of the plan view of FIG.33. FIG. 35 is a plan view showing a layout of the gate electrode, thedummy gate, and the fin of the semiconductor device according to thepresent embodiment. FIG. 36 is a circuit diagram showing theconfiguration of the semiconductor device according to the presentembodiment.

The plan view of FIG. 33 shows two p-channel FINFETs (PFT1, PFT2) andtwo n-channel FINFETs (NFT1, NFT2) that make up two inverters. That is,this drawing shows two p-channel FINFETs (PFT1, PFT2) and two n-channelFINFETs (NFT1, NFT2) that make up the inverter INV1 at the front stageand inverter INV2 at the rear stage shown in FIG. 36. Here, theexplanation will be made while a region for forming the inverters INV1and INV2 is regarded as the unit cell.

The FINFETs (PFT1, NFT1) making up the inverter INV1 are arranged in theleft region of the unit cell of the present embodiment, and the FINFETs(PFT2, NFT2) making up the inverter INV2 are arranged in the centralregion of the unit cell. Although the configuration of the FINFETs(PFT2, NFT2) making up the inverter INV2 is the same as theconfiguration of that of the first embodiment, the configuration of theFINFETs (PFT1, NFT1) making up the inverter INV1 is different from theconfiguration of that of the first embodiment. Specifically, while twoFINFETs (PFT2, NFT2) making up the inverter INV2 are connected by thelocal interconnects (LIC1, LIC2) having the substantial U shapedescribed in the first embodiment, two FINFETs (PFT1, NFT1) making upthe inverter INV1 are connected by the wiring M1.

In this manner, according to the semiconductor device of the presentembodiment, two FINFETs (PFT2, NFT2) making up the inverter INV2 areconnected by the local interconnects LIC having the substantial U shape.Therefore, as described in detail in the first embodiment, the formingarea (cell area) of the semiconductor device can be reduced. And, theintegration degree of the semiconductor elements (FINFETs) can beincreased.

According to the semiconductor device of the present embodiment, twoFINFETs (PFT1, NFT1) making up the inverter INV1 are connected by usingan interconnect layer (i.e., layer of the wiring M1) different from thelocal interconnects LIC, and therefore, the forming area (cell area) ofthe semiconductor device can be reduced. And, the integration degree ofthe semiconductor element (FINFET) can be increased.

The inverter INV1 at the front stage shown in FIG. 36 has the p-channelFINFET (PFT1) and n-channel FINFET (NFT1) that are connected in seriesbetween the source potential (VDD) and the ground potential (VSS). Thesep-channel FINFET (PFT1) and n-channel FINFET (NFT1) are arranged on theleft side in the drawing (in the left region of the unit cell). The gateelectrodes (GE) of the PFT1 and NFT1 are connected to an input portion(IN1), and a connection portion between the PFT1 and NFT1 becomes anoutput portion (OUT1).

The inverter INV2 at the rear stage shown in FIG. 36 has the p-channelFINFET (PFT2) and n-channel FINFET (NFT2) that are connected in seriesbetween the source potential (VDD) and the ground potential (VSS). Thesep-channel FINFET (PFT2) and n-channel FINFET (NFT2) are arranged at thecenter in the drawing (in the central region of the unit cell). The gateelectrodes (GE) of the PFT2 and NFT2 are connected to an input portion(IN2), and a connection portion between the PFT2 and NFT2 becomes anoutput portion (OUT2). The input portion (IN2) is connected to theoutput portion (OUT1) of the inverter INV1 at the front stage.

The planar shape (shape or cell layout in a plan view viewed from above)of each component of the semiconductor device of the present embodimentwill be described with reference to FIG. 33.

As shown in FIG. 33, the planar shape of each fin F is a linear shapehaving a certain width (length in the X direction) (a rectangular shapewith long sides extending in the Y direction). In FIG. 33, two fins Fare arranged in the X direction at a certain interval (pitch) (see FIG.35).

As shown in FIG. 33, the planar shape of each gate electrode GE is alinear shape having a certain width (length in the Y direction) (arectangular shape with long sides extending in the X direction). In thismanner, the gate electrode GE extends in a direction of crossing thefins F. Here, in addition to the gates GE extending in the direction ofcrossing the fins F, the dummy gates DG are also provided. Each dummygate DG has the same configuration as that of the gate electrode GE.That is, the dummy gate DG also has a linear shape having a certainwidth (length in the Y direction) (a rectangular shape with long sidesextending in the X direction). In FIG. 33, five of the gate electrodesGE and dummy gates DG are arranged at a certain interval (interval inthe Y direction, the minimum pitch in the Y direction, a grid) (see FIG.35). By arranging the dummy gates DG as described above, the patternregularity can be secured, so that the variation in the manufacturing orothers can be reduced.

Here, the area (Y grid) between the gate electrode GE and the dummy gateDG is denoted as “YG”. In FIG. 33, for example, the Y girds YG1 to YG4are arranged sequentially from left.

The left gate electrode GE (Gn, Gp) of the gate electrodes GE (Gn, Gp)extending in the direction of crossing the fins F is the gate electrodeGE making up the inverter INV1, while the right gate electrode GE (Gn,Gp) thereof is the gate electrode GE making up the inverter INV2. Notethat the gate electrode GE is made of a conductive film extendingintegrally in the X direction. However, in the region for forming thep-channel FINFET (PFT), the gate electrode GE in this region is shown asthe gate electrode Gp because a p-type impurity is introduced thereto.Also, in the region for forming the n-channel FINFET (NFT), the gateelectrode GE in this region is shown as the gate electrode Gn because ann-type impurity is introduced thereto. By these gate electrodes Gp andGn, the gate electrode GE is made up.

Here, the above-described interval in the Y direction (width of the Ygrid in the Y direction) is the reference for determining the length ofthe unit cell in the Y direction. For example, when the interval thereofin the Y direction is 0.09 μm, the length of the unit cell in the Ydirection is determined to be 0.09×4=0.36 μm. Here, when the lengththereof in the X direction is 0.77 μm, the cell area of the unit cellshown in FIG. 33 is 0.2772 μm².

The source region Sp and the drain region Dp are arranged in the fin Fon both sides of the gate electrode GE (Gp). Also, the source region Snand the drain region Dn are arranged in the fin F on both sides of thegate electrode GE (Gn). Note that the fins F and the gate electrode GEoverlap with each other so as to interpose the gate insulating film (GI)therebetween (see FIG. 34). More specifically, the gate insulating film(GI) is arranged on the side surfaces and front surface of the fins F inthe region where the fins F and the gate electrode GE overlap.

As shown in FIG. 33, the planar shape of each local interconnect (LIC1,LIC2) is a rectangular shape with long sides extending in the Xdirection or a rectangular shape with long sides extending in the Ydirection. Here, in FIG. 33, the rectangular one (portion, location)with long sides extending in the X direction is denoted as “LIC1”, whilethe rectangular one (portion, location) with long sides extending in theY direction is denoted as “LIC2”. The local interconnects (LIC1, LIC2)are formed by burying a conductive film in trenches formed in theinterlayer insulating film (IL1). When these trenches are formed, apatterned photoresist film is used as a mask. When the photoresist filmis processed (exposed to light), a rectangular pattern with long sidesextending in the X direction and a rectangular pattern with long sidesextending in the Y direction are transferred individually. By suchprocessing, even a fine pattern can be formed with high accuracy.

The drain regions (Dp, Dn) of the p-channel FINFET (PFT2) and n-channelFINFET (NFT2) making up the inverter INV2 are connected by the localinterconnects (LIC1, LIC2) (FIGS. 33 and 34).

The drain region Dp of the p-channel FINFET (PFT2) is extracted by thelocal interconnect LIC1. This local interconnect LIC1 is connected to alocal interconnect LIC1 connected to the output portion (OUT2) through alocal interconnect LIC2 crossing the dummy gate DG. The drain region(Dn) of the n-channel FINFET (NFT2) is extracted by the localinterconnect LIC1. This local interconnect LIC1 is connected to a localinterconnect LIC1 connected to the output portion (OUT2) through a localinterconnect LIC2 crossing the dummy gate DG. In this manner, in FIG.33, the drain regions (Dp, Dn) are connected by five local interconnects(LIC1, LIC2). These five local interconnects (LIC1, LIC2) form asubstantial U shape.

Note that the drain regions (Dp, Dn) may be connected by three localinterconnects (LIC1, LIC2). That is, the drain regions (Dp, Dn) may beconnected directly to the local interconnects LIC2 extending in the Ydirection, and the local interconnect LIC1 connected to the outputportion (OUT2) is connected therebetween.

As shown in FIG. 33, a common source region (Sp, node n1) shared betweenthe p-channel FINFET (PFT2) making up the inverter INV2 and p-channelFINFET (PFT1) making up the inverter INV1 is connected to the localinterconnect LIC1. In other words, the source region Sp of the p-channelFINFET (PFT2) making up the inverter INV2 serves also as the sourceregion Sp of the p-channel FINFET (PFT1) making up the inverter INV1,and this common source region Sp is connected to the local interconnectLIC1. This local interconnect LIC1 is connected to a wiring M1 (VDD) towhich the source potential (VDD) is supplied through a via V0.

A common source region (Sn, node n2) shared between the n-channel FINFET(NFT2) making up the inverter INV2 and n-channel FINFET (NFT1) making upthe inverter INV1 is connected to the local interconnect LIC1. In otherwords, the source region Sn of the n-channel FINFET (NFT2) making up theinverter INV2 serves also as the source region Sn of the n-channelFINFET (NFT1) making up the inverter INV1, and this common source regionSn is connected to the local interconnect LIC1. This local interconnectLIC1 is connected to a wiring M1 (VSS) connected the source potential(VSS) through a via V0.

In this manner, the local interconnect LIC1 used for supplying thesource potential (VDD) is shared between two p-channel FINFETs (PFT1,PFT2). Also, the local interconnect LIC1 used for supplying the groundpotential (VSS) is shared between two n-channel FINFETs (NFT1, NFT2).According to such a layout, the forming area (cell area) of thesemiconductor device can be reduced. Also, the integration degree of thesemiconductor element (FINFET) can be increased.

As shown in FIG. 33, the local interconnect LIC2 is arranged on theboundary between the gate electrode Gp and the gate electrode Gn thatmake up the inverter IN1. This local interconnect LIC2 is connected to awiring M1 (IN1) through a via V0 (see FIG. 34).

Also, as shown in FIG. 33, the local interconnect LIC2 is arranged onthe boundary between the gate electrode Gp and the gate electrode Gnthat make up the inverter IN2. This local interconnect LIC2 is connectedto a wiring M1 (OUT1, IN2) through a via V0 (see FIG. 34).

In the left region of the unit cell shown in FIG. 33, the FINFETs (PFT1,NFT1) making up the inverter INV1 are arranged. The drain regions (Dp,Dn) of the p-channel FINFET (PFT1) and n-channel FINFET (NFT1) making upthe inverter INV1 are connected by the above-described wiring M1 (OUT1,IN2). This wiring M1 (OUT1, IN2) has a substantial U shape.

Specifically, the drain region (Dp) of the p-channel FINFET (PFT1) isextracted by the local interconnect LIC1. This local interconnect LIC1is connected to the wiring M1 (OUT1, IN2). The drain region (Dn) of then-channel FINFET (NFT1) is extracted by the local interconnect LIC1.This local interconnect LIC1 is also connected to the above-describedwiring M1 (OUT1, IN2). And, the local interconnect LIC2 is arranged onthe boundary between the gate electrodes Gp and Gn of two FINFETs (PFT2,NFT2) that make up the inverter INV2. This local interconnect LIC2 isconnected to the above-described wiring M1 (OUT1, IN2) through a via V0.

The wiring M1 (OUT1, IN2) serves as the output portion of the inverterIN1 and as the input portion of the inverter INV2. And, the wiring M1(IN1) serves as the input portion of the inverter INV1.

In this manner, according to the semiconductor device of the presentembodiment, two FINFETs (PFT, NFT) making up the inverter INV1 areconnected by using an interconnect layer (here, a layer of the wiringM1) different from the local interconnect LIC, and therefore, theforming area (cell area) of the semiconductor device can be reduced.And, the integration degree of the semiconductor element (FINFET) can beincreased.

Note that the semiconductor device of the present embodiment isdifferent from the semiconductor device of the first embodiment in aplanar shape of each component (F, GE, DG, LIC1, LIC2, and M1). However,this can be formed by processes which are almost the same as theprocesses in the first embodiment.

(First Application Example)

In the semiconductor device of the above-described aspect (FIGS. 33 and35), the fins F are extended to a portion below the dummy gates DG (thefirst and fourth dummy gates DG counted from the left in FIGS. 33 and35). However, as shown in FIG. 37, the fins F may be arranged so as tocross the gate electrodes GE only. FIG. 37 is a plan view showing alayout of a gate electrode, a dummy gate, and a fin of a semiconductordevice of the present application example. The semiconductor device ofthe first application example is the same as the semiconductor device ofthe above-described aspect (FIG. 33) except for the configuration of thefin F, and therefore, detailed description of a configuration of thesemiconductor device and a manufacturing method for the same will beomitted.

Also in the present application example, the forming area (cell area) ofthe semiconductor device can be reduced. And, the integration degree ofthe semiconductor element (FINFET) can be increased.

(Second Application Example)

In the semiconductor device of the above-described first applicationexample (FIG. 37), the fins F are arranged so as to cross the gateelectrodes GE only. However, the fins F may be continuously arranged inthe Y direction in the region for forming the unit cell without beingdivided (see FIG. 38). In this case, the fin F passes through a portionbelow each of the dummy gates DG located on both sides of two gateelectrodes GE, and extends to the adjacent Y grid (such as the first,fourth, and fifth dummy gates DG from the left in FIG. 38). FIG. 38 is aplan view showing a layout of a gate electrode, a dummy gate and a finof the present application example. FIG. 39 is a plan view showing alayout of the semiconductor device of the present application example.

In the present application example, the dummy transistor described inthe third embodiment is formed. For example, in FIG. 39, the p-channeldummy transistor (DPT) is formed in the upper-half region of the unitcell, while the n-channel dummy transistor (DNT) is formed in thelower-half region of the unit cell.

Here, in the p-channel dummy transistor (DPT), the dummy gate DG and thelocal interconnect LIC1 connected to the source potential (VDD) areconnected to each other through the local interconnect LIC22, so thatthe potential of the dummy gate DG can be fixed to the source potential(VDD). Also, in the n-channel dummy transistor (DNT), the dummy gate DGand the local interconnect LIC1 connected to the ground potential (VSS)are connected to each other through the local interconnect LIC22, sothat the potential of the dummy gate DG can be fixed to the groundpotential (VSS). In this manner, these dummy transistors (DPT, DNT) arenot turned to ON, so that the influence on the circuit operations can beavoided (see the left end of FIG. 39).

In FIG. 39, also in the p-channel dummy transistor (DPT) in a right-endupper-half region of the unit cell and the n-channel dummy transistor(DNT) in a right-end lower-half region of the unit cell, the potentialof the dummy gate DG can be fixed to the source potential (VDD) orground potential (VSS) as similar to the above-described cases althoughnot shown in detail.

Also, in FIG. 39, the second p-channel dummy transistor (DPT) countedfrom the right end of the unit cell is not turned to ON because nopotential difference (between the source and the drain) is generated inthe impurity region in the fin F on both sides, and therefore, there isno problem on the circuit operations. Similarly, in FIG. 39, the secondn-channel dummy transistor (DNT) counted from the right end of the unitcell is not turned to ON because no potential difference (between thesource and the drain) is generated in the impurity region in the fin Fon both sides, and therefore, there is no problem on the circuitoperations.

Also in the present application example, the forming area (cell area) ofthe semiconductor device can be reduced. And, the integration degree ofthe semiconductor element (FINFET) can be increased.

Further, by largely extending the fins F in the Y direction, themobility of carriers is improved because of the strain effect. Besides,the ON current can be increased by the improvement.

Note that the semiconductor device of the present embodiment isdifferent from the case of the semiconductor device of the firstembodiment in a planar shape of each component (F, GE, DG, LIC1, LIC2,and M1). However, the component can be formed by processes almost thesame as the processes in the first embodiment.

(Fifth Embodiment)

In the first embodiment, the substantial U-shaped local interconnect LICis used for the output portion of the inverter. However, theabove-described local interconnect LIC may be used for an output portionof a two-input NAND.

FIG. 40 is a plan view showing a configuration of a semiconductor deviceaccording to the present embodiment. FIG. 41 is a cross-sectional viewshowing the configuration of the semiconductor device according to thepresent embodiment. The cross-sectional view of FIG. 41 corresponds to,for example, across section taken along a line A-A of the plan view ofFIG. 40. FIG. 42 is a circuit diagram showing the configuration of thesemiconductor device according to the present embodiment.

The plan view of FIG. 40 shows a plan layout of each component of twop-channel FINFETs (PFT1, PFT2) and two n-channel FINFETs (NFT1, NFT2)that make up a two-input NAND. In the present embodiment, a region forforming the two-input NAND is described as the unit cell. Thecross-sectional view of FIG. 41 shows a cross section obtained by twop-channel FINFETs (PFT1, PFT2) and two n-channel FINFETs (NFT1, NFT2)that make up the two-input NAND. In the two-input NAND, as shown in FIG.42, two p-channel FINFETs (PFT1, PFT2) are connected in parallel betweenthe source potential (VDD) and the output portion OUT, while twon-channel FINFETs (NFT1, NFT2) are connected in series between theoutput portion OUT and the ground potential (VSS). The gate electrode ofone pair of the p-channel FINFET (PFT1) and the n-channel FINFET (NFT1)becomes a first input portion IN1, while the gate electrode of anotherpair of the p-channel FINFET (PFT2) and the n-channel FINFET (NFT2)becomes a second input portion IN2.

The planar shape (shape or cell layout in a plan view from above) ofeach component of the semiconductor device of the present embodimentwill be described with reference to FIG. 40.

As shown in FIG. 40, the planar shape of each fin F is a linear shapehaving a certain width (length in the X direction) (a rectangular shapewith long sides extending in the Y direction). In FIG. 40, two fins Fare arranged in the X direction at a certain interval (pitch).

As shown in FIG. 40, the planar shape of each gate electrode GE is alinear shape having a certain width (length in the Y direction) (arectangular shape with long sides extending in the X direction). Asdescribed above, the gate electrode GE extends in a direction ofcrossing the fins F. Here, in addition to the gates GE extending in thedirection of crossing the fins F, the dummy gates DG are also provided.Each dummy gate DG has the same configuration as that of the gateelectrode GE. That is, the dummy gate DG has a linear shape having acertain width (length in the Y direction) (a rectangular shape with longsides extending in the X direction). In FIG. 40, five of gate electrodesGE and dummy gates DG are arranged at a certain interval (interval inthe Y direction, the minimum pitch in the Y direction, a grid). Byarranging the dummy gates DG as described above, the pattern regularitycan be ensured, and the variation in the manufacturing or others can bereduced.

Here, the area (Y grid) between the gate electrode GE and the dummy gateDG is denoted by “YG”. In FIG. 40, for example, the Y girds YG1 to YG4are arranged sequentially from the left.

Two gate electrodes GE (Gn, Gp) extend in the direction of crossing thefins F. The gate electrode GE is made of a conductive film extendingintegrally in the X direction. However, in the region for forming thep-channel FINFET (PFT), the gate electrode GE in this region is shown asthe gate electrode Gp because a p-type impurity is introduced thereto.Also, in the region for forming the n-channel FINFET (NFT), the gateelectrode GE in this region is shown as the gate electrode Gn because ann-type impurity is introduced thereto. The gate electrode GE is made upby these gate electrodes Gp and Gn.

Here, the above-described interval in the Y direction (width in the Ydirection of the Y grid) is the reference for determining the length ofthe unit cell in the Y direction. For example, when the interval in theY direction is 0.09 μm, the length of the unit cell in the Y directionis determined to be 0.09×4=0.36 μm. Here, when the length thereof in theX direction is 0.77 μm, the cell area of the unit cell shown in FIG. 40is 0.2772 μm².

The source region Sp and the drain region Dp are formed in the fin F onboth sides of the gate electrode GE (Gp). Also, the source region Sn andthe drain region Dn are formed in the fin F on both sides of the gateelectrode GE (Gn). Note that the fin F and the gate electrode GE overlapwith each other through the gate insulating film (GI) (see FIG. 41).More specifically, the gate insulating film (GI) is arranged on the sidesurfaces and front surface of the fin F in the overlap region betweenthe fin F and the gate electrode GE.

As shown in FIG. 40, the planar shape of each local interconnect (LIC1,LIC2) is a rectangular shape with long sides extending in the Xdirection or a rectangular shape with long sides extending in the Ydirection. The local interconnect (LIC1, LIC2) is formed by burying aconductive film in a trench formed in the interlayer insulating film(IL1). When these trenches are formed, a processed photoresist film isused as a mask. When the photoresist film is processed (exposed tolight), a rectangular pattern with long sides extending in the Xdirection and a rectangular pattern with long sides extending in the Ydirection are transferred individually. According to such processing,even a fine pattern can be formed with high accuracy.

The drain regions (Dp, Dn) of one pair of the p-channel FINFET (PFT2)and n-channel FINFET (NFT2) making up the two-input NAND are connectedto each other through the local interconnects (LIC1, LIC2). This pair ofthe p-channel FINFET (PFT2) and n-channel FINFET (NFT2) has the thirdgate electrode GE counted from the left end of the unit cell.

The drain region (Dp) of the p-channel FINFET (PFT2) is extracted by alocal interconnect LIC1. This local interconnect LIC1 is connected to alocal interconnect LIC1 connected to the output portion (OUT) through alocal interconnect LIC2 crossing the dummy gate DG. The drain region(Dn) of the n-channel FINFET (NFT2) is extracted by a local interconnectLIC1. This local interconnect LIC1 is connected to a local interconnectLIC1 connected to the output portion (OUT) through a local interconnectLIC2 crossing the dummy gate DG. As described above, in FIG. 40, thedrain regions (Dp, Dn) are connected to each other through five localinterconnects (LIC1, LIC2). These five local interconnects (LIC1, LIC2)are formed in a substantial U shape.

In FIG. 40, a common source region (Sp, node n1) shared between the twop-channel FINFETs (PFT1, PFT2) is connected to the local interconnectLIC1. This local interconnect LIC1 is connected to a wiring M1 (VDD) towhich the source potential (VDD) is applied through a via V0. Each drainregion Dp of the two p-channel FINFET (PFT1, PFT2) is extracted by thelocal interconnect LIC1. The two local interconnects LIC1 are connectedto a wiring M1 through a via V0.

A source region Sn of the left n-channel FINFET (NFT1) of two n-channelFINFETs (NFT1, NFT2) shown in FIG. 40 is connected to the localinterconnect LIC1. This local interconnect LIC1 is connected to a wiringM1 (VSS) connected to the ground potential (VSS) through a via V0 (seeFIG. 41). Note that an impurity region (source/drain region) sharedbetween two n-channel FINFETs (NFT1, NFT2) shown in FIGS. 40 and 41 isdenoted as “SDn”.

As described above, even when the local interconnect LIC is used as theoutput portion of the two-input NAND, the forming area (cell area) ofthe semiconductor device can be reduced. And, the integration degree ofthe semiconductor element (FINFET) can be increased.

(First Application Example)

In the semiconductor device of the above-described aspect (FIG. 40), thefins F are extended to a portion below the dummy gates DG (the first andfourth dummy gates DG counted from the left in FIG. 40). However, asshown in FIG. 43, the fins F may be extended so as to cross the gateelectrodes GE only. FIG. 43 is a plan view showing a layout of a gateelectrode, a dummy gate, and a fin of a semiconductor device of thepresent application example. The semiconductor device of the presentapplication example is the same as the semiconductor device of theabove-described aspect (FIG. 40) except for the configuration of the finF, and therefore, detailed description of a configuration of thesemiconductor device and a manufacturing method for the same will beomitted.

Also in the present application example, the forming area (cell area) ofthe semiconductor device can be reduced. And, the integration degree ofthe semiconductor element (FINFET) can be increased.

(Second Application Example)

In the semiconductor device of the present application example (FIG.43), the fins F are arranged so as to cross the gate electrodes GE only.However, the fins F may be continuously arranged in the Y direction inthe region for forming the unit cell (see FIG. 44) without beingdivided. In this case, the fin F passes through a portion below each ofthe dummy gates DG located on both sides of two gate electrodes GE, andextends to the adjacent Y grid (such as the first, fourth, and fifthdummy gates DG counted from the left in FIG. 44). FIG. 44 is a plan viewshowing a layout of a gate electrode, a dummy gate and a fin of thesemiconductor device of the present application example. FIG. 45 is aplan view showing a layout of the semiconductor device of the presentapplication example.

In the present application example, the dummy transistors described inthe third embodiment are formed. For example, in FIG. 45, the p-channeldummy transistor (DPT) is formed in the upper-half region of the unitcell. And, the n-channel dummy transistor (DNT) is formed in thelower-half region of the unit cell (see FIG. 44).

Here, in the p-channel dummy transistor (DPT), the dummy gate DG and thelocal interconnect LIC1 connected to the source potential (VDD) areconnected to each other through the local interconnect LIC22, so thatthe potential of the dummy gate DG can be fixed to the source potential(VDD). Also, in the n-channel dummy transistor (DNT), the dummy gate DGand the local interconnect LIC1 connected to the ground potential (VSS)are connected to each other through the local interconnect LIC22, sothat the potential of the dummy gate DG can be fixed to the groundpotential (VSS). In this manner, these dummy transistors (DPT, DNT) arenot turned to ON, so that the influence on circuit operations can beavoided (see the left end of FIG. 45).

Although not shown in FIG. 45, the potential of the dummy gate DG can befixed to the source potential (VDD) or ground potential (VSS) also inthe p-channel dummy transistor (DPT) in a right-end upper-half region ofthe unit cell and the n-channel dummy transistor (DNT) in a right-endlower-half region of the unit cell as similar to the above-describedcases.

The second p-channel dummy transistor (DPT) counted from the right endof the unit cell shown in FIGS. 44 and 45 is not turned to ON because nopotential difference (between the source and the drain) is generated inthe impurity region in the fin F on both sides, and therefore, there isno problem on the circuit operations. Similarly, the second n-channeldummy transistor (DNT) counted from the right end of the unit cell shownin FIGS. 44 and 45 is not turned to ON because no potential difference(between the source and the drain) is generated in the impurity regionin the fin F on both sides, and therefore, there is no problem on thecircuit operations.

Also in the present application example, the forming area (cell area) ofthe semiconductor device can be reduced. And, the integration degree ofthe semiconductor element (FINFET) can be increased.

Also, by largely extending the fins F in the Y direction, the mobilityof carriers can be improved because of a strain effect. Also, the ONcurrent can be increased by the improvement.

Note that the semiconductor device of the present embodiment isdifferent from the semiconductor device of the first embodiment in theplanar shape of each component (F, GE, DG, LIC1, LIC2, and M1). However,this can be formed by processes almost the same as the processes in thefirst embodiment.

(Sixth Embodiment)

In the fifth embodiment, the substantial U-shaped local interconnect LICis used for the output portion of the two-input NAND. However, theabove-described local interconnect LIC may be used for an output portionof a two-input NOR.

FIG. 46 is a plan view showing a configuration of a semiconductor deviceaccording to the present embodiment. FIG. 47 is a cross-sectional viewshowing the configuration of the semiconductor device according to thepresent embodiment. The cross-sectional view of FIG. 47 corresponds to,for example, across section taken along a line A-A of the plan view ofFIG. 46. FIG. 48 is a circuit diagram showing the configuration of thesemiconductor device according to the present embodiment.

The plan view of FIG. 46 shows a plan layout of each component of twop-channel FINFETs (PFT1, PFT2) and two n-channel FINFETs (NFT1, NFT2)that make up a two-input NOR. In the present embodiment, a region forforming the two-input NOR is described as the unit cell. Thecross-sectional view of FIG. 47 shows a cross section formed by twop-channel FINFETs (PFT1, PFT2) and two n-channel FINFETs (NFT1, NFT2)that make up the two-input NOR. In the two-input NOR, as shown in FIG.48, two p-channel FINFETs (PFT1, PFT2) are connected in series betweenthe source potential (VDD) and the output portion OUT, while twon-channel FINFETs (NFT1, NFT2) are connected in parallel between theground potential (VSS) and the output portion OUT. And, the gateelectrode of one pair of the p-channel FINFET (PFT1) and the n-channelFINFET (NFT1) becomes the first input portion IN1, while the gateelectrode of another pair of the p-channel FINFET (PFT2) and then-channel FINFET (NFT2) becomes the second input portion IN2.

First, the planar shape (shape or cell layout in a plan view from above)of each component of the semiconductor device of the present embodimentwill be described with reference to FIG. 46.

As shown in FIG. 46, the planar shape of each fin F is a linear shapehaving a certain width (length in the X direction) (a rectangular shapewith long sides extending in the Y direction). In FIG. 46, two fins Fare arranged in the X direction at a certain interval (pitch).

As shown in FIG. 46, the planar shape of each gate electrode GE is alinear shape having a certain width (length in the Y direction) (arectangular shape with long sides extending in the X direction). Asdescribed above, the gate electrode GE thus extends in a direction ofcrossing the fins F. Here, in addition to the gates GE extending in thedirection of crossing the fins F, the dummy gates DG are also provided.Each dummy gate DG has the same configuration as that of the gateelectrode GE. That is, the dummy gate DG also has a linear shape havinga certain width (length in the Y direction) (a rectangular shape withlong sides extending in the X direction). In FIG. 46, five of gateelectrodes GE and dummy gates DG are arranged at a certain interval(interval in the Y direction, the minimum pitch in the Y direction, agrid). By arranging the dummy gates DG as described above, the patternregularity can be secured, and the variation in the manufacturing orothers can be reduced.

Here, the area (Y grid) between the gate electrode GE and the dummy gateDG is denoted as “YG”. In FIG. 46, for example, the Y girds YG1 to YG4are arranged sequentially from left.

Two gate electrodes GE (Gn, Gp) extend in the direction of crossing thefins F. The gate electrode GE is made of a conductive film extendingintegrally in the X direction. However, in the region for forming thep-channel FINFET (PFT), the gate electrode GE in this region is shown asthe gate electrode Gp because a p-type impurity is introduced thereto.Also, in the region for forming the n-channel FINFET (NFT), the gateelectrode GE in this region is shown as the gate electrode Gn because ann-type impurity is introduced thereto. The gate electrode GE is made upby these gate electrodes Gp and Gn.

Here, the above-described interval in the Y direction (width in the Ydirection of the Y grid) is the reference for determining the length ofthe unit cell in the Y direction. For example, when the interval in theY direction is 0.09 μm, the length of the unit cell in the Y directionis determined to be 0.09×4=0.36 μm. Here, when the length thereof in theX direction is 0.77 μm, the cell area of the unit cell of FIG. 46 is0.2772 μm².

The source region Sp and the drain region Dp are formed in the fin F onboth sides of the gate electrode GE (Gp). Also, the source region Sn andthe drain region Dn are formed in the fin F on both sides of the gateelectrode GE (Gn). Note that the fin F and the gate electrode GE overlapwith each other through the gate insulating film (GI) (see FIG. 47).More specifically, the gate insulating film (GI) is arranged on the sidesurfaces and the front surface of the fin F in the overlap regionbetween the fin F and the gate electrode GE.

As shown in FIG. 46, the planar shape of each local interconnect (LIC1,LIC2) is a rectangular shape with long sides extending in the Xdirection or a rectangular shape with long sides extending in the Ydirection. The local interconnect (LIC1, LIC2) is formed by burying aconductive film in a trench formed in the interlayer insulating film(IL1). When the trench is formed, a processed photoresist film is usedas a mask. When the photoresist film is processed (exposed to light), arectangular pattern with long sides extending in the X direction and arectangular pattern with long sides extending in the Y direction aretransferred individually. According to such processing, even a finepattern can be formed with high accuracy.

The drain regions (Dp, Dn) of one pair of the p-channel FINFET (PFT2)and n-channel FINFET (NFT2) making up the two-input NOR are connectedthrough the local interconnects (LIC1, LIC2). This pair of the p-channelFINFET (PFT2) and n-channel FINFET (NFT2) has the third gate electrodeGE counted from the left end of the unit cell.

The drain region (Dp) of the p-channel FINFET (PFT2) is extracted by alocal interconnect LIC1. This local interconnect LIC1 is connected to alocal interconnect LIC1 connected to the output portion (OUT), through alocal interconnect LIC2 crossing the dummy gate DG. The drain region(Dn) of the n-channel FINFET (PFT2) is extracted by a local interconnectLIC1. This local interconnect LIC1 is connected to a local interconnectLIC1 connected to the output portion (OUT), through a local interconnectLIC2 crossing the dummy gate DG. As described above, in FIG. 46, thedrain regions (Dp, Dn) are connected through five local interconnects(LIC1, LIC2). These five local interconnects (LIC1, LIC2) are formed ina substantial U shape.

And, a common source region Sn (node n2) shared between two n-channelFINFETs (NFT1, NFT2) shown in FIG. 46 is connected to a localinterconnect LIC1. This local interconnect LIC1 is connected to a wiringM1 (VSS) to which the ground potential (VSS) is applied through a viaV0. The drain region Dp of each of the two n-channel FINFETs (NFT1,NFT2) is extracted by the local interconnect LIC1. These two localinterconnects LIC1 are connected by a wiring M1 through a via V0.

A source region Sp of the left p-channel FINFET (PFT) of two p-channelFINFETs (PFT1, PFT2) shown in FIG. 46 is connected to a localinterconnect LIC1. This local interconnect LIC1 is connected to a wiringM1 (VDD) connected to the source potential (VDD), through a via V0 (seeFIG. 47). Note that an impurity region (source/drain region) sharedbetween two p-channel FINFETs (PFT1, PFT2), which impurity region isshown in FIGS. 46 and 47 is denoted as “SDp”.

As described above, also when the local interconnect LIC is used as theoutput portion of the two-input NOR, the forming area (cell area) of thesemiconductor device can be reduced. And, the integration degree of thesemiconductor element (FINFET) can be increased.

(First Application Example)

In the semiconductor device of the above-described aspect (FIG. 46), thefins F are extended to a portion below the dummy gates DG (the first andfourth dummy gates DG counted from the left in FIG. 46). However, assimilar to the first application example of the fifth embodiment (FIG.43), the fins F may be arranged so as to cross the gate electrodes GEonly. The semiconductor device of the present application example is thesame as the semiconductor device of the above-described aspect (FIG. 46)except for the configuration of the fin F, and therefore, detaileddescription of a configuration of the semiconductor device and a methodof manufacturing the same will be omitted.

Also in the present application example, the forming area (cell area) ofthe semiconductor device can be reduced. And, the integration degree ofthe semiconductor element (FINFET) can be increased.

(Second Application Example)

In the semiconductor device of the first application example, the fins Fare arranged so as to cross the gate electrodes GE only (see FIG. 43).However, the fins F may be continuously arranged in the Y direction inthe region for forming the unit cell without being divided (see FIG.49). In this case, the fin F passes through a portion below each of thedummy gates DG located on both sides of two gate electrodes GE, andextends to the adjacent Y grid (such as the first, fourth, and fifthdummy gates DG counted from the left in FIG. 49). FIG. 49 is a plan viewshowing a layout of the semiconductor device of the present applicationexample.

In the present application example, the dummy transistors described inthe third embodiment are formed. For example, in FIG. 49, the p-channeldummy transistor (DPT) is formed in a left-end upper-half region of theunit cell. And, the n-channel dummy transistor (DNT) is formed in aleft-end lower-half region of the unit cell.

Also in the present application example, as similar to the secondapplication example of the fifth embodiment, the potential of the dummygate DG of the dummy transistor is fixed to the source potential (VDD)or ground potential (VSS) (see FIG. 44).

That is, in the p-channel dummy transistor (DPT), the dummy gate DG andthe local interconnect LIC1 connected to the source potential (VDD) areconnected through the local interconnect LIC22, so that the potential ofthe dummy gate DG can be fixed to the source potential (VDD). Also, inthe n-channel dummy transistor (DNT), the dummy gate DG and the localinterconnect LIC1 connected to the ground potential (VSS) are connectedthrough the local interconnect LIC22, so that the potential of the dummygate DG can be fixed to the ground potential (VSS). In this manner,these dummy transistors (DPT, DNT) are not turned to ON, and theinfluence on the circuit operations can be avoided (see the left end ofFIG. 49).

Although not shown in FIG. 49, the potential of the dummy gate DG can befixed to the source potential (VDD) or the ground potential (VSS) alsoin the p-channel dummy transistor (DPT) in a right-end upper-half regionof the unit cell and the n-channel dummy transistor (DNT) in a right-endlower-half region of the unit cell as similar to the above-describedcases.

The second p-channel dummy transistor (DPT) counted from the right endof the unit cell shown in FIG. 49 is not turned to ON because nopotential difference (between the source and the drain) is generated inthe impurity region in the fin F on both sides, and therefore, there isno problem on the circuit operations. Similarly, the second n-channeldummy transistor (DNT) counted from the right end of the unit cell shownin FIG. 49 is not turned to ON because no potential difference (betweenthe source and the drain) is generated in the impurity region in the finF on both sides, and therefore, there is no problem on the circuitoperations.

Also in the present application example, the forming area (cell area) ofthe semiconductor device can be reduced. And, the integration degree ofthe semiconductor element (FINFET) can be increased.

By largely extending the fins F in the Y direction, the mobility ofcarriers is improved because of a strain effect. Also, the ON currentcan be increased by the improvement.

Note that the semiconductor device of the present embodiment isdifferent from the semiconductor device of the first embodiment in theplanar shape of each component (F, GE, DG, LIC1, LIC2, and M1). However,this can be manufactured by processes almost the same as the processesin the first embodiment.

(Seventh Embodiment)

In the fifth embodiment, the substantial U-shaped local interconnect LICis used as the output portion of the two-input NAND. However, theabove-described local interconnect LIC may be used as an output portionof a four-input NAND.

FIG. 50 is a plan view showing a configuration of a semiconductor deviceaccording to the present embodiment. FIG. 51 is a cross-sectional viewshowing the configuration of the semiconductor device according to thepresent embodiment. The cross-sectional view of FIG. 51 corresponds to,for example, across section taken along a line A-A of the plan view ofFIG. 50. FIG. 52 is a circuit diagram showing the configuration of thesemiconductor device according to the present embodiment.

The plan view of FIG. 50 shows a plan layout of each component of fourp-channel FINFETs (PFT1 to PFT4) and four n-channel FINFETs (NFT1 toNFT4) that make up a four-input NAND. In the present embodiment, aregion for forming the four-input NAND is described as the unit cell.The cross-sectional view of FIG. 51 shows a cross section formed by thefour p-channel FINFETs (PFT1 to PFT4) and the four n-channel FINFETs(NFT1 to NFT4) that make up the four-input NAND. In the four-input NAND,as shown in FIG. 52, the four p-channel FINFETs (PFT1 to PFT4) areconnected in parallel between the source potential (VDD) and the outputportion OUT, while the four n-channel FINFETs (NFT1 to NFT4) areconnected in series between the ground potential (VSS) and the outputportion OUT. And, a gate electrode of a pair of the p-channel FINFET(PFT1) and the n-channel FINFET (NFT1) becomes an input portion (IN1),and a gate electrode of a pair of the p-channel FINFET (PFT2) and then-channel FINFET (NFT2) becomes an input portion (IN2). Similarly, agate electrode of a pair of the p-channel FINFET (PFT3) and then-channel FINFET (NFT3) becomes an input portion (IN3), and a gateelectrode of a pair of the p-channel FINFET (PFT4) and the n-channelFINFET (NFT4) becomes an input portion (IN4).

The planar shape (shape or cell layout in a plan view from above) ofeach component of the semiconductor device of the present embodimentwill be described with reference to FIG. 50.

As shown in FIG. 50, the planar shape of each fin F is a linear shapehaving a certain width (length in the X direction) (a rectangular shapewith long sides extending in the Y direction). In FIG. 50, two fins Fare arranged in the X direction at a certain interval (pitch).

As shown in FIG. 50, the planar shape of each gate electrode GE is alinear shape having a certain width (length in the Y direction) (arectangular shape with long sides extending in the X direction). Asdescribed above, the gate electrode GE extends in a direction ofcrossing the fins F. Here, in addition to the gates GE extending in thedirection of crossing the fins F, the dummy gates DG are also provided.Each dummy gate DG has the same configuration as that of the gateelectrode GE. That is, the dummy gate DG also has a linear shape havinga certain width (length in the Y direction) (a rectangular shape withlong sides extending in the X direction). In FIG. 50, seven of gateelectrodes GE and dummy gates DG are arranged at a certain interval(interval in the Y direction, the minimum pitch in the Y direction, agrid). By arranging the dummy gates DG as described above, the patternregularity can be secured, and the variation in the manufacturing orothers can be reduced.

Here, the area (Y grid) between the gate electrode GE and the dummy gateDG is denoted as “YG”. For example, in FIG. 50, the Y girds YG1 to YG6are arranged sequentially from left.

Four gate electrodes GE (Gn, Gp) extend in the direction of crossing thefins F. The gate electrode GE is made of a conductive film extendingintegrally in the X direction. However, in the region for forming thep-channel FINFET (PFT), the gate electrode GE in this region is denotedas the gate electrode Gp because a p-type impurity is introducedthereto. Also, in the region for forming the n-channel FINFET (NFT), thegate electrode GE in this region is denoted as the gate electrode Gnbecause an n-type impurity is introduced thereto. The gate electrode GEis made up by these gate electrodes Gp and Gn.

Here, the above-described interval in the Y direction (width in the Ydirection of the Y grid) is the reference for determining the length ofthe unit cell in the Y direction. For example, when the interval in theY direction is 0.09 μm, the length of the unit cell in the Y directionis determined to be 0.09×6=0.54 μm. Here, when the length thereof in theX direction is 0.77 μm, the cell area of the unit cell shown in FIG. 50is 0.4158 μm².

The source region Sp and the drain region Dp are formed in the fin F onboth sides of the gate electrode GE (Gp). Also, the source region Sn andthe drain region Dn are formed in the fin F on both sides of the gateelectrode GE (Gn). Note that the fin F and the gate electrode GE overlapwith each other through the gate insulating film (GI) (see FIG. 51).More specifically, the gate insulating film (GI) is arranged on the sidesurfaces and front surface of the fin F in the overlap region betweenthe fin F and the gate electrode GE.

As shown in FIG. 50, the planar shape of each local interconnect (LIC1,LIC2) is a rectangular shape with long sides extending in the Xdirection or a rectangular shape with long sides extending in the Ydirection. The local interconnect (LIC1, LIC2) is formed by burying aconductive film in a trench formed in the interlayer insulating film(IL1). When the trench is formed, a processed photoresist film is usedas a mask. When the photoresist film is processed (exposed to light), arectangular pattern with long sides extending in the X direction and arectangular pattern with long sides extending in the Y direction aretransferred individually. According to such processing, even a finepattern can be formed with high accuracy.

The drain regions (Dp, Dn) of one pair of the p-channel FINFET (PFT4)and n-channel FINFET (NFT4) making up the four-input NAND are connectedby the local interconnect (LIC1, LIC2). This pair of the p-channelFINFET (PFT4) and n-channel FINFET (NFT4) has the fifth gate electrodeGE counted from the left end of the unit cell.

The drain region (Dp) of the p-channel FINFET (PFT4) is extracted by thelocal interconnect LIC1. This local interconnect LIC1 is connected to alocal interconnect LIC1 connected to the output portion (OUT) through alocal interconnect LIC2 crossing the dummy gate DG. The drain region(Dn) of the n-channel FINFET (NFT4) is extracted by the localinterconnect LIC1. This local interconnect LIC1 is connected to a localinterconnect LIC1 connected to the output portion (OUT) through a localinterconnect LIC2 crossing the dummy gate DG. As described above, inFIG. 50, the drain regions (Dp, Dn) are connected by five localinterconnects (LIC1, LIC2). These five local interconnects (LIC1, LIC2)form a substantial U shape.

Common source regions Sp shared among the four p-channel FINFETs (PFT1to PFT4) shown in FIG. 50 are connected to local interconnects LIC1.These interconnects LIC1 are connected to a wiring M1 (VDD) to which thesource potential (VDD) is applied through vias V0. Each of the drainregions Dp of the four p-channel FINFETs (PFT1 to PFT4) is extracted bythe local interconnect LIC1. These three local interconnects LIC1 areconnected by a wiring M1 through vias V0.

A source region Sn of the left-end n-channel FINFET (NFT1) of fourn-channel FINFETs (NFT1 to NFT4) shown in FIG. 50 is connected to alocal interconnect LIC1. This local interconnect LIC1 is connected to awiring M1 (VSS) connected to the ground potential (VSS) through a via V0(see FIG. 51). Note that common source/drain regions shared between then-channel FINFETs shown in FIGS. 50 and 51 are denoted as “SDn”.

As described above, even when the local interconnect LIC is used as theoutput portion of the four-input NAND, the forming area (cell area) ofthe semiconductor device can be reduced. And, the integration degree ofthe semiconductor element (FINFET) can be increased.

In the semiconductor device of the present aspect (FIG. 50), the fins Fmay be arranged so as to cross the gate electrodes GE only as similar tothe first application example of the fifth embodiment. Also in thesemiconductor device of the present aspect (FIG. 50), the fins F may becontinuously arranged in the Y direction in the region for forming theunit cell without being divided. In this case, as similar to the secondapplication example of the fifth embodiment, the potential of the dummygate DG of the p-channel dummy transistor (DPT) and n-channel dummytransistor (DNT) may be fixed to the source potential (VDD) or theground potential (VSS). In this manner, the influence of these dummytransistors (DPT, DNT) on the circuit operations can be avoided.

(Eighth Embodiment)

In the sixth embodiment, the substantial U-shaped local interconnect LICis used as the output portion of the two-input NOR. However, theabove-described local interconnect LIC may be used as an output portionof a four-input NOR.

FIG. 53 is a plan view showing a configuration of a semiconductor deviceaccording to the present embodiment. FIG. 54 is a cross-sectional viewshowing the configuration of the semiconductor device according to thepresent embodiment. The cross-sectional view of FIG. 54 corresponds to,for example, across section taken along a line A-A of the plan view ofFIG. 53. FIG. 55 is a circuit diagram showing the configuration of thesemiconductor device according to the present embodiment.

The plan view of FIG. 53 shows a plan layout of each component of fourp-channel FINFETs (PFT1 to PFT4) and four n-channel FINFETs (NFT1 toNFT4) that make up a four-input NOR. In the present embodiment, a regionfor forming the four-input NOR is described as the unit cell. Thecross-sectional view of FIG. 54 shows a section formed by the fourp-channel FINFETs (PFT1 to PFT4) and four n-channel FINFETs (NFT1 toNFT4) that make up the four-input NOR. As shown in FIG. 55, in thefour-input NOR, the four p-channel FINFETs (PFT1 to PFT4) are connectedin series between the source potential (VDD) and the output portion OUT,while the four n-channel FINFETs (NFT1 to NFT4) are connected inparallel between the ground potential (VSS) and the output portion OUT.A gate electrode of a pair of the p-channel FINFET (PFT1) and then-channel FINFET (NFT1) becomes the input portion (IN1), and a gateelectrode of a pair of the p-channel FINFET (PFT2) and the n-channelFINFET (NFT2) becomes the input portion (IN2). Similarly, a gateelectrode of a pair of the p-channel FINFET (PFT3) and the n-channelFINFET (NFT3) becomes the input portion (IN3), and a gate electrode of apair of the p-channel FINFET (PFT4) and the n-channel FINFET (NFT4)becomes the input portion (IN4).

The planar shape (shape or cell layout in a plan view from above) ofeach component of the semiconductor device of the present embodimentwill be described with reference to FIG. 53.

As shown in FIG. 53, the planar shape of each fin F is a linear shapehaving a certain width (length in the X direction) (a rectangular shapewith long sides extending in the Y direction). In FIG. 53, two fins Fare arranged in the X direction at a certain interval (pitch).

As shown in FIG. 53, the planar shape of each gate electrode GE is alinear shape having a certain width (length in the Y direction) (arectangular shape with long sides extending in the X direction). In thismanner, the gate electrode GE extends in a direction of crossing thefins F. Here, in addition to the gate electrodes GE extending in thedirection of crossing the fins F, the dummy gates DG are also provided.Each dummy gate DG has the same configuration as that of the gateelectrode GE. That is, the dummy gate DG also has a linear shape havinga certain width (length in the Y direction) (a rectangular shape withlong sides extending in the X direction). In FIG. 53, seven of the gateelectrodes GE and dummy gates DG are arranged at a certain interval(interval in the Y direction, the minimum pitch in the Y direction, agrid). By arranging the dummy gates DG as described above, the patternregularity can be secured, and the variation in the manufacturing orothers can be reduced.

Here, the area (Y grid) between the gate electrode GE and the dummy gateDG is denoted as “YG”. In FIG. 53, for example, the Y girds YG1 to YG6are arranged sequentially from left.

Two gate electrodes GE (Gn, Gp) extend in the direction of crossing thefins F. The gate electrode GE is made of a conductive film extendingintegrally in the X direction. However, in the region for forming thep-channel FINFET (PFT), the gate electrode GE in this region is denotedas the gate electrode Gp because a p-type impurity is introducedthereto. Also, in the region for forming the n-channel FINFET (NFT), thegate electrode GE in this region is denoted as the gate electrode Gnbecause an n-type impurity is introduced thereto. The gate electrode GEis made up by the gate electrodes Gp and Gn.

Here, the above-described interval in the Y direction (width in the Ydirection of the Y grid) is the reference for determining the length ofthe unit cell in the Y direction. For example, when the interval in theY direction is 0.09 μm, the length of the unit cell in the Y directionis determined to be 0.09×6=0.54 μm. Here, when the length thereof in theX direction is 0.77 μm, the cell area of the unit cell of FIG. 53 is0.4158 μm².

The source region Sp and the drain region Dp are formed in the fin F onboth sides of the gate electrode GE (Gp). Also, the source region Sn andthe drain region Dn are formed in the fin F on both sides of the gateelectrode GE (Gn). Note that the fin F and the gate electrode GE overlapwith each other through the gate insulating film (GI) (see FIG. 54).More specifically, the gate insulating film (GI) is arranged on the sidesurfaces and the front surface of the fin F in the overlap regionbetween the fin F and the gate electrode GE.

As shown in FIG. 53, the planar shape of each local interconnect (LIC1,LIC2) is a rectangular shape with long sides extending in the Xdirection or a rectangular shape with long sides extending in the Ydirection. The local interconnect (LIC1, LIC2) is formed by burying aconductive film in a trench formed in the interlayer insulating film(IL1). When the trench is formed, a processed photoresist film is usedas a mask. When the photoresist film is processed (exposed to light), arectangular pattern with long sides extending in the X direction and arectangular pattern with long sides extending in the Y direction aretransferred individually. According to such processing, even a finepattern can be formed with high accuracy.

The drain regions (Dp, Dn) of one pair of the p-channel FINFET (PFT4)and n-channel FINFET (NFT4) making up the four-input NOR are connectedby the local interconnect (LIC1, LIC2). This pair of the p-channelFINFET (PFT4) and n-channel FINFET (NFT4) has the fifth gate electrodeGE counted from the left end of the unit cell.

The drain region (Dp) of the p-channel FINFET (PFT4) is extracted by alocal interconnect LIC1. This local interconnect LIC1 is connected to alocal interconnect LIC1 connected to the output portion (OUT) through alocal interconnect LIC2 crossing the dummy gate DG. Also, the drainregion (Dn) of the n-channel FINFET (NFT4) is extracted by a localinterconnect LIC1. This local interconnect LIC1 is connected to theabove local interconnect LIC1 connected to the output portion (OUT)through a local interconnect LIC2 crossing the dummy gate DG. Asdescribed above, in FIG. 54, the drain regions (Dp, Dn) are connected byfive local interconnects (LIC1, LIC2). These five local interconnects(LIC1, LIC2) form a substantial U shape.

Common source regions Sn shared between four n-channel FINFETs (NFT1 toNFT4) shown in FIG. 53 are connected to local interconnects LIC1. Theseinterconnect LIC1 are connected to a wiring M1 (VSS) to which the groundpotential (VSS) is applied through vias V0. Each drain region Dn of thefour n-channel FINFETs (NFT1 to NFT4) are extracted by the localinterconnect LIC1. These three local interconnects LIC1 are connected bya wiring M1 through vias V0.

A source region Sp of the left-end p-channel FINFET (PFT1) of fourp-channel FINFETs (PFT1 to PFT4) shown in FIG. 53 is connected to alocal interconnect LIC1. This local interconnect LIC1 is connected to awiring M1 (VDD) connected to the source potential (VDD) through a via V0(see FIG. 54). Note that common source/drain regions shared among fourp-channel FINFETs (PFT1 to PFT4) shown in FIGS. 53 and 54 are denoted as“SDp”.

Also, even when the local interconnect LIC is used as the output portionof the four-input NOR, the forming area (cell area) of the semiconductordevice can be reduced. And, the integration degree of the semiconductorelement (FINFET) can be increased.

In the semiconductor device of the present aspect (FIG. 53), the fins Fmay be arranged so as to cross the gate electrodes GE only as similar tothe first application example of the sixth embodiment. In thesemiconductor device of the present aspect (FIG. 53), the fins F may becontinuously arranged in the Y direction in the region for forming theunit cell without being divided. In this case, as similar to the secondapplication example of the sixth embodiment, the potential of the dummygate DG of the p-channel dummy transistor (DPT) and n-channel dummytransistor (DNT) may be fixed to the source potential (VDD) or theground potential (VSS). In this manner, the influence of these dummytransistors (DPT, DNT) on the circuit operations can be avoided.

In the above-described embodiments, the impurity regions in the fin aredescribed as the drain region, the source region and others. However,these regions may be treated as one end (first electrode, electrode) ofa transistor and the other end thereof (second electrode, electrode).

Also, as described above, the dummy gate described above in theembodiments is an electrode that is not turned to ON. In other words,the dummy gate is an electrode that cannot be turned to ON and OFF. Instill other words, the dummy gate is an electrode not having a channelformed therebelow.

In the foregoing, the invention made by the present inventors has beenconcretely described based on the embodiments. However, it is needlessto say that the present invention is not limited to the foregoingembodiments and various modifications and alterations can be made withinthe scope of the present invention.

For example, in the fourth embodiment, the circuit having two inverters(such as a flip-flop circuit) has been exemplified. However, asubstantial U-shaped local interconnect or a substantial U-shaped wiringmay be applied to a circuit having three or more inverters. In the fifthto eighth embodiments, the two-input and four-input circuits (NAND andNOR) have been exemplified. However, the number of inputs is notlimited, and the substantial U-shaped local interconnect may be appliedto an output portion of a circuit having the different number in theinputs. Also, it is needless to say that the above-described localinterconnect, etc., can be applied to other logic circuits within thescope of the present invention.

[Additional Note 1]

A semiconductor device includes: a rectangular parallelepiped first finextending in a first direction; a rectangular parallelepiped second finarranged to be separated from the first fin and extending in the firstdirection; a gate electrode arranged on the first and second finsthrough a gate insulating film and extending in a second directioncrossing the first direction; a first electrode of a first transistorformed in the first fin positioned on one side of the gate electrode; asecond electrode of the first transistor formed in the first finpositioned on the other side of the gate electrode; a first electrode ofa second transistor formed in the second fin positioned on the one sideof the gate electrode; a second electrode of the second transistorformed in the second fin positioned on the other side of the gateelectrode; and a first local wiring for connecting the first electrodeof the first transistor and the first electrode of the secondtransistor. The first local wiring is made of a conductive film buriedin an interlayer insulating film covering the gate electrode.

[Additional Note 2]

In the semiconductor device described in the additional note 1, thesemiconductor device further includes a third transistor and a fourthtransistor. A first electrode of the third transistor and a firstelectrode of the fourth transistor are connected by a wiring formed in awiring layer different from that of the local wiring, and the secondelectrode of the first transistor serves also as a second electrode ofthe third transistor, and the second electrode of the first transistoris connected to a wiring to which a source potential is applied.

[Additional Note 3]

In the semiconductor device described in the additional note 2, thesecond electrode of the second transistor serves also as a secondelectrode of the fourth transistor, and the second electrode of thesecond transistor is connected to a wiring to which a ground potentialis applied.

[Additional Note 4]

In the semiconductor device described in the additional note 1, thesemiconductor device further includes a third transistor and a fourthtransistor, the second electrode of the first transistor is connected toone electrode of the third transistor, and the second electrode of thesecond transistor is connected to one electrode of the fourthtransistor.

[Additional Note 5]

In the semiconductor device described in the additional note 1, thesemiconductor device further includes a third transistor and a fourthtransistor, a first electrode of the third transistor is connected tothe local wiring, and the second electrode of the first transistor isconnected to a wiring to which a source potential is applied.

[Additional Note 6]

In the semiconductor device described in the additional note 5, a secondelectrode of the fourth transistor is connected to a wiring to which aground potential is applied.

[Additional Note 7]

In the semiconductor device described in the sixth additional note, thesecond electrode of the first transistor serves also as a secondelectrode of the third transistor, and the second electrode of thesecond transistor serves also as a first electrode of the fourthtransistor.

[Additional Note 8]

In the semiconductor device described in the additional note 1, thesemiconductor device further includes a third transistor and a fourthtransistor, the first electrode of the fourth transistor is connected tothe local wiring, and the second electrode of the second transistor isconnected to a wiring to which a source potential is applied.

[Additional Note 9]

In the semiconductor device described in the additional note 8, a secondelectrode of the third transistor is connected to a wiring to which asource potential is applied.

[Additional Note 10]

In the semiconductor device described in the ninth additional note, thesecond electrode of the second transistor serves also as a secondelectrode of the fourth transistor, and the second electrode of thefirst transistor serves also as a first electrode of the thirdtransistor.

What is claimed is:
 1. A semiconductor device comprising: a rectangularparallelepiped first fin extending in a first direction; a rectangularparallelepiped second fin arranged to be separated from the first finand extending in the first direction; a gate electrode arranged on thefirst fin and the second fin through a gate insulating film andextending in a second direction crossing the first direction; a firstelectrode of a first transistor formed in the first fin positioned onone side of the gate electrode; a second electrode of the firsttransistor formed in the first fin positioned on the other side of thegate electrode; a first electrode of a second transistor formed in thesecond fin positioned on the one side of the gate electrode; a secondelectrode of the second transistor formed in the second fin positionedon the other side of the gate electrode; a first local wiring forconnecting the first electrode of the first transistor and the firstelectrode of the second transistor, wherein the first local wiring ismade of a conductive film buried in an interlayer insulating filmcovering the gate electrode and includes: a first portion extending inthe first direction and electrically connected to the first electrode ofthe first transistor; a second portion extending in the first directionand electrically connected to the first electrode of the secondtransistor; and a third portion extending in the second direction andconnecting the first portion and the second portion, a dummy gatearranged to be separated from the gate electrode and extending in thesecond direction, wherein the dummy gate is positioned below the firstportion and the second portion, and a second local wiring extending inthe second direction and connected to the second electrode of the firsttransistor, wherein the second local wiring is connected to a wiring towhich a source potential is applied.
 2. The semiconductor deviceaccording to claim 1, further comprising a first wiring formed above theinterlayer insulating film, wherein the first local wiring is positionedin a lower layer than the first wiring.
 3. The semiconductor deviceaccording to claim 1, wherein the first local wiring includes: a fourthportion extending in the second direction and connected between thefirst electrode of the first transistor and the first portion; and afifth portion extending in the second direction and connected betweenthe first electrode of the second transistor and the second portion. 4.The semiconductor device according to claim 1, further comprising: afirst grid which is a region between the gate electrode and the dummygate; and a second grid which is a region positioned to be opposite to agate electrode of the dummy gate, wherein the third portion is arrangedin the second grid.
 5. The semiconductor device according to claim 1,further comprising a third local wiring extending in the seconddirection and connected to the second electrode of the secondtransistor, wherein the third local wiring is connected to a wiring towhich a reference potential is applied.
 6. The semiconductor deviceaccording to claim 1, wherein the gate electrode, and the firstelectrode of the first transistor and the second electrode of the firsttransistor which are formed in the first fin, make up the firsttransistor, and the gate electrode, and the first electrode of thesecond transistor and the second electrode of the second transistorwhich are formed in the second fin, make up the second transistor. 7.The semiconductor device according to claim 6, wherein the firsttransistor and the second transistor make up an inverter.
 8. Thesemiconductor device according to claim 7, wherein an input portion ofthe inverter is the gate electrode, and an output portion of theinverter is the third portion.
 9. The semiconductor device according toclaim 4, wherein the first fin and the second fin are arranged on thefirst grid but are not arranged below the dummy gate.
 10. Thesemiconductor device according to claim 4, wherein the first fin and thesecond fin are arranged so as to extend to a portion below the dummygate but are not formed on the second grid.
 11. The semiconductor deviceaccording to claim 4, wherein the first fin and the second fin passesthrough a portion below the dummy gate so as to be arranged also on thesecond grid.
 12. The semiconductor device according to claim 4, furthercomprising: a rectangular parallelepiped third fin extending in thefirst direction; a different gate electrode arranged on the third finthrough a gate insulating film and extending in the second direction; afirst electrode of a third transistor, the first electrode being formedin the third fin positioned on one side of the different gate electrode;and a second electrode of the third transistor, the second electrodebeing formed in the third fin positioned on the other side of thedifferent gate electrode.
 13. The semiconductor device according toclaim 12, further comprising: a rectangular parallelepiped fourth finarranged to be separated from the third fin and extending in the firstdirection; the different gate electrode arranged on the third fin andthe fourth fin through a gate insulating film and extending in thesecond direction; a first electrode of a fourth transistor, the firstelectrode being formed in the fourth fin positioned on one side of thedifferent gate electrode; and a second electrode of the fourthtransistor, the second electrode being formed in the fourth finpositioned on the other side of the different gate electrode.
 14. Thesemiconductor device according to claim 13, wherein the second electrodeof the third transistor is connected to a wiring to which a sourcepotential is applied, and the second electrode of the fourth transistoris connected to a wiring to which a reference potential is applied. 15.The semiconductor device according to claim 11, further comprising: adifferent gate electrode arranged to be separated from the dummy gateand extending in the second direction, the different gate electrodebeing arranged on the first fin and the second fin through a gateinsulating film; the first electrode of the third transistor, the firstelectrode being formed in the first fin positioned on one side of thedifferent gate electrode; the second electrode of the third transistor,the second electrode being formed in the first fin positioned on theother side of the different gate electrode; the first electrode of thefourth transistor, the first electrode being formed in the second finpositioned on the one side of the different gate electrode; and thesecond electrode of the fourth transistor, the second electrode beingformed in the second fin positioned on the other side of the differentgate electrode.
 16. The semiconductor device according to claim 15,further comprising: a fourth local wiring extending in the seconddirection and connected to the second electrode of the third transistor;and a fifth local wiring extending in the second direction and connectedto the second electrode of the fourth transistor, wherein the fourthlocal wiring is connected to a wiring to which a source potential isapplied, and the fifth local wiring is connected to a wiring to which areference potential is applied.
 17. The semiconductor device accordingto claim 16, further comprising: a different dummy gate extending in thesecond direction between the dummy gate and the different gateelectrode; a sixth local wiring connecting a source region of the thirdtransistor and the different dummy gate; and a seventh local wiringconnecting the source region of the third transistor and the differentdummy gate.